Design For Manufacture （1）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
1
|
Inner layer(18um, 35um, 70um etc
are finished copper. If not mentioned copper, finished 1oz is the default
value )
|
Min.isolation
of layers
|
0.1mm
|
0.1mm
|
0.06mm
|
|
2
|
Min.track
and spacing
|
5/5mil(18um)
|
4/4mil(18um)
|
3/3.5mil(18um)
|
|
3
|
5/5mil(35um)
|
4/4mil(35um)
|
3/4mil(35um)
|
|
4
|
7/9mil(70um)
|
6/8mil(70um)
|
6/7mil(70um)
|
|
5
|
9/11mil(105um)
|
8/10mil(105um)
|
8/9mil(105um)
|
|
6
|
13/13mil(140um)
|
12/12mil(140um)
|
12/11mil(140um)
|
|
7
|
Min.distance
from drill to conductor
|
4
Layer 10mil，6 layer 10mil，8-12 layer 12mil
|
4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil
|
4
layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
|
|
8
|
Min.width
of annular ring on inner layer
|
4
Layer 10mil（35um），≥6 Layer 14mil（35um）
|
4
Layer 8mil(35um)，≥6 layer 12mil（35um）
|
4
Layer 6mil（35um），≥6 Layer 10mil（35um）
|
|
9
|
Inner
layer isolation ring width(Min)
|
10mil
（35um）
|
8mil
（35um）
|
6mil
（35um）
|
|
10
|
Min.via
pad diameter
|
20mil
（35um）
|
16mil
（35um）
|
16mil
（35um）
|
|
11
|
Min.
distance from board edge to conductor(no copper exposured)(inner layer)
|
14
mil（35um）
|
12
mil（35um））
|
8
mil（35um）
|
|
12
|
Maximum
copper weight(Inner layer and outer layer)
|
3
OZ( 105 um )
|
4
OZ ( 140 um )
|
6
OZ( 210 um )
|
|
13
|
Core
with different copper foil on both sides
|
/
|
18/35,35/70
um
|
18/35,35/70
um
|
Design For Manufacture （2）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
14
|
Laminating
|
Tolerance
of laminate thickness
|
±10%
PCB thick
|
±10%
PCB thick
|
±8%
PCB thick
|
|
15
|
Maximum
laminate thickness
|
4.0mm
|
6.0mm
|
7.0mm
|
|
16
|
Laminate alignment accuracy
|
≤±5
mil
|
≤±4
mil
|
≤±4
mil
|
|
17
|
Drill(18um, 35um, 70um etc are
finished copper. If not mentioned copper, finished 1oz is the default value
)
|
Min.drill
bit diameter
|
0.2
mm
|
0.2
mm
|
0.2
mm
|
|
18
|
Min.slot
router diameter
|
0.60
mm
|
0.60
mm
|
0.60
mm
|
|
19
|
Min.tolerance
of PTH slots
|
±0.15mm
|
±0.15mm
|
±0.1mm
|
|
20
|
Max.aspect
ratio
|
1:08
|
1:12
|
1:12
|
|
21
|
Hole
tolerance
|
±3mil
|
±3mil
|
±3mil
|
|
22
|
Space
of via to via
|
6mil(same
net)，12mil(different net)
|
6mil(same
net)，14mil(different net)
|
4mil(same
net)，12mil(different net)
|
|
23
|
Space
of component hole to component hole
|
12mil(same
net)，16mil(different net)
|
12mil(same
net)，16mil(different net)
|
10mil(same
net)，14mil(different net)
|
|
24
|
Etching
|
Min.width
of etching logo
|
10mil(18um)，12
mil (35um)，12 mil(70um）
|
8mil(18um)，10mil(35um)，12
mil(70um）
|
6mil(18um)，8
mil(35um)，12mil(70um）
|
|
25
|
Etch
factor
|
1.6-2.2
|
1.6-2.2
|
1.6-2.2
|
|
26
|
Outer layer(18um, 35um, 70um etc are
finished copper. If not mentioned copper, finished 1oz is the default value )
|
Min.via
pad diameter
|
20mil
|
16mil
|
16mil
|
|
27
|
Min.BGA
pad diameter
|
12mil
|
12mil
|
10mil
|
|
28
|
Min.track
and spacing
|
5/5mil(18um)
|
4/4mil(18um)
|
3/3.5mil(18um)
|
|
5/5mil(35um)
|
4/4mil(35um)
|
3/4mil(35um)
|
|
7/9mil(70um)
|
6/8mil(70um)
|
6/7mil(70um)
|
|
9/11mil(105um)
|
8/10mil(105um)
|
8/9mil(105um)
|
|
13/13mil(140um)
|
12/12mil(140um)
|
12/11mil(140um)
|
|
29
|
Minimum
grid
|
10/10mil(35um)
|
8/8mil(35um)
|
4/8mil(35um)
|
|
30
|
Min.space
(conductor to pad, pad to pad)
|
6mil(18um)
|
5mil(18um)
|
4mil(18um)
|
|
6mil(35um)
|
5mil(35um)
|
4mil(35um)
|
|
9mil(70um)
|
8mil(70um)
|
7mil(70um)
|
|
11mil(105um)
|
10mil(105um)
|
9mil(105um)
|
|
13mil(140um)
|
12mil(140um)
|
11mil(140um)
|
Design For Manufacture （3）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
31
|
Solder mask(18um, 35um, 70um etc
are finished copper. If not mentioned copper, finished 1oz is the default
value )
|
Maximum
via-plug diameter
|
0.5mm
|
0.5mm
|
0.5mm
|
|
32
|
Min.width
of solder mask bridge
|
Green:5mil（35um）
|
Green:4mil（35um）
|
Green:4mil（35um）
|
|
33
|
Yellow：5mil（35um）
|
Yellow：4mil（35um）
|
Yellow：4mil（35um）
|
|
34
|
Blue：5mil（35um）
|
Blue：4mil（35um）
|
Blue：4mil（35um）
|
|
35
|
Black：6mil（35um）
|
Black：6mil（35um）
|
Black：6mil（35um）
|
|
36
|
White:6mil（35um）
|
White:6mil（35um）
|
White:6mil（35um）
|
|
37
|
All
of Matt：6mil
|
All
of Matt：6mil
|
All
of Matt：6mil
|
|
38
|
Green:5mil（70um）
|
Green:4mil（70um）
|
Green:4mil（70um）
|
|
39
|
Yellow：5mil（70um）
|
Yellow：4mil（70um）
|
Yellow：4mil（70um）
|
|
40
|
Blue：5mil（70um）
|
Blue：4mil（70um）
|
Blue：4mil（70um）
|
|
41
|
Black：6mil（70um）
|
Black：6mil（70um）
|
Black：6mil（70um）
|
|
42
|
White:6mil（70um）
|
White:6mil（70um）
|
White:6mil（70um）
|
|
43
|
Open
solder mask
|
4mil(35um)
|
4mil(35um)
|
3mil(35um)
|
|
44
|
Solder
mask coverage
|
4mil(35um)
|
4mil(35um)
|
3mil(35um)
|
|
45
|
Min.width
of solder mask text
|
9mil(35um)
|
9mil(35um)
|
8mil(35um)
|
|
46
|
Min.thickness
of Solder mask
|
9um(35um)
|
9um(35um)
|
9um(35um)
|
|
47
|
Max.thickness
of solder mask
|
30um(35um)
|
30um(35um)
|
30um(35um)
|
Design For Manufacture （4）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
48
|
Silkscreen
|
Min.width
of silkscreen text
|
6mil
|
6mil
|
5mil
|
|
49
|
Min.height
of silkscreen text
|
35mil
|
35mil
|
30mil
|
|
50
|
Min.space
from silkscreen to pads
|
6mil
|
6mil
|
5mil
|
|
51
|
Colour
of silkscreen
|
White,
Black, Yellow
|
|
52
|
Carbon
ink
|
Carbon
ink covers conductor or pads
|
14mil
|
13mil
|
12mil
|
|
53
|
Mid
distance from carbon ink to pads
|
12mil
|
11mil
|
10mil
|
|
54
|
Peelable
mask
|
Peelable
mask covers conductor or pads
|
8mil
|
7mil
|
6mil
|
|
55
|
Min.distance
from peelable mask to pads
|
14mil
|
13mil
|
12mil
|
|
56
|
Max.via-plug
of Silk-screen method
|
2.0mm
|
2.0mm
|
2.0mm
|
|
57
|
Max.
via-plug of aluminum foil method
|
4.5mm
|
4.5mm
|
4.5mm
|
|
58
|
Surface
finish
|
Thickness
of nickel of ENIG
|
3-5um
|
3-5um
|
2-6.35um
|
|
59
|
Thickness
of Gold of ENIG
|
0.05-0.1um
|
|
60
|
Thickness
of nickel of Gold finger
|
3-5um
|
|
61
|
Thickness
of Gold of Gold finger
|
0.1-1.27um
|
|
62
|
Thickness
of tin of HASL
|
2.54-6.35um
|
|
63
|
Thickness
of OSP
|
0.2-0.5um
|
|
64
|
Thickness
of tin of Immersion tin
|
0.2-0.75um
|
|
65
|
Thickness
of silver of Immersion silver
|
0.15-0.75um
|
Design For Manufacture （5）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
66
|
Contour
process
|
Method
of contour process
|
CNC
milling, V-CUT, Break-out tap, break-out holes, Punching
|
|
67
|
Minimum
router
|
0.8mm
|
|
68
|
Min.tolerance
of contour
|
±0.15mm
|
±0.13mm
|
±0.1mm
|
|
69
|
Min.distance
of milling contour(no copper exposure)
|
12mil
|
10mil
|
8mil
|
|
70
|
Angle
of V-CUT
|
20、30、45、60
±5 degree
|
|
71
|
Degree
of symmetry of V-CUT
|
±6mil
|
±5mil
|
±4mil
|
|
72
|
Tolerance of residual thickness of V-CUT
|
±6mil
|
±5mil
|
±4mil
|
|
73
|
Tolerance
of Chamfer angle of Gold finger
|
±5
degree
|
±5
degree
|
±5
degree
|
|
74
|
Tolerance
of residual thickness of bevel edge of gold finger
|
±5mil
|
±5mil
|
±5mil
|
|
75
|
Min
radius of inner corner
|
0.4mm
|
|
76
|
Min.
distance from edge to V-Cut (no copper exposure)
|
18mil
(1.6mm Thick, 20 degree V-groove cutter)
|
14mil(1.6mm
Thick, 20 degree V-groove cutter)
|
12mil
(1.6mm Thick, 20 degree V-groove cutter)
|
|
77
|
20mil
(1.6mm Thick, 30 degree V-groove cutter)
|
18mil
(1.6mm Thick, 30 degree V-groove cutter)
|
16mil
(1.6mm Thick, 30 degree V-groove cutter)
|
|
78
|
24mil
(1.6mm Thick, 45 degree V-groove cutter)
|
22mil
(1.6mm Thick, 45 degree V-groove cutter)
|
20mil
(1.6mm Thick, 45 degree V-groove cutter)
|
|
79
|
30mil
(1.6mm Thick, 60 degree V-groove cutter)
|
28mil
(1.6mm Thick, 60 degree V-groove cutter)
|
26mil
(1.6mm Thick, 60 degree V-groove cutter)
|
Design For Manufacture （6）
|
Serial
NO.
|
Procedure
|
Item
|
Manufacturing
capability
|
|
Large volume （S<100 m²）
|
Middle volume（S<10 m²）
|
Prototype（S<1m²）
|
|
80
|
Special
tolerance
|
Board
thickness of flying probe test
|
0.6-4.0mm
|
|
81
|
Panel
size of flying probe test
|
Size≤900X600mm,
Small size can be compensated through manufacturing procedure
|
|
82
|
Panel
size of fixture test method
|
Size≤460X380mm,Small size can be compensated through
manufacturing procedure
|
|
83
|
Board
thickness of fixture test method
|
0.4-6.0mm
|
|
84
|
Tolerance
of press-fit hole
|
±2mil
|
|
85
|
Tolerance
of NPTH
|
±2mil
|
|
86
|
Tolerance
of PCB thickness
|
1.0mm≥PCB
thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
|
|
87
|
Tolerance
of depth of countersunk hole
|
±0.2mm
|
|
88
|
Depth
tolerance of blind slot
|
±0.2mm
|
|
89
|
Maximum
shipment size
|
Size≤1200X600mm（Double side, no test required）
|
|
90
|
Size≤1000X600mm（Multilayer, no test required）
|
|
91
|
Minimum
shipment size
|
10X10mm
|
|
92
|
PCB
thickness of HASL
|
0.8-3.0mm(Hole
less 0.5mm should be use via-plug or mask-tent )
|
|
93
|
HASL
PCB Size
|
Size≤600X460mm
|
|
94
|
PCB
thickness
|
0.15-7.0mm
|
|
95
|
Depth
of V groove
|
0.8-3.2mm
|
|
96
|
Distance
of non-continuous v-groove
|
≥7mm
|
|
97
|
Max.
drill diameter
|
Size≤6.5mm
(Counterbore or router will be used for holes more than 6.5mm, Min.tolerance
±0.1mm）
|
|
98
|
Max.
countersink diameter
|
Size≤6.5mmCountersink can be used counterbore drill or router）
|
|
99
|
Distance
of Bevel
|
Size≥11mm
|
Size≥5mm
|
Size≥5mm
|
|
100
|
Thickness
of peelable mask
|
0.2-1.5mm
±0.15mm
|
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