- PCB Capability

Item	Production Capability (Summery)
Layer Counts	1-32
Substrate Materials	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600 mm
Board Outline Tolerance	±0.15 mm
PCB Thickness	0.20 mm--6.00 mm
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.075 mm--5.00 mm
Minimum Track	0.075 mm
Minimum Space	0.075 mm
Outer Copper Thickness	35 um--420 um
Inner Copper Thickness	17 um--210 um
Drill Hole(Mechanical)	0.2 mm--6.35 mm
Laser Hole	0.1 mm
Finished Hole(Mechanical)	0.10 mm--6.30 mm
DiameterTolerance(Mechanical)	0.075 mm
Registration (Mechanical)	0.05 mm
Aspect Ratio	12:01
Solder Mask Type	LPI
Minimum Soldermask Bridge	0.08 mm
Minimum Soldermask Clearance	0.05 mm
Plug via Diameter	0.25 mm--0.60 mm
Impedance Control Tolerance	±10%
Surface Finish	HASL, HASL Lead Free, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger