Global PCB Industry Shows Resilience Amidst Challenging Times

Despite the challenges faced by the global PCB industry, the Prismark report reveals promising trends and growth prospects. In 2023, the industry experienced a 15.0% year-on-year decrease in output value in U.S. dollars. However, experts project a steady growth trajectory in the medium to long term. The compound annual growth rate for global PCB output value from 2023 to 2028 is expected to reach 5.4%.

Regional Growth and Product Structure:

The PCB industry's growth is not limited to a specific region but spans all corners of the globe. Mainland China has emerged as a significant player, with a compound growth rate of 4.1%. Looking at the product structure, packaging substrates, high-multilayer boards with 18 layers and above, and HDI boards are set to experience substantial growth in the next five years. These segments are projected to achieve compound growth rates of 8.8%, 7.8%, and 6.2%, respectively.

Driving Factors for Packaging Substrate Products:

Packaging substrate products are witnessing increased demand due to two primary factors. Firstly, the technological advancements and expanding application scenarios, such as artificial intelligence, cloud computing, smart driving, and the Internet of Everything, are driving the electronics industry's need for high-end chips and advanced packaging. This sustained growth is particularly notable in high-computing power and integration scenarios. Secondly, the government's increased support for the semiconductor industry, coupled with additional investments, is accelerating the development of the domestic packaging substrate industry. As terminal manufacturers' semiconductor inventories normalize, the global semiconductor market is predicted to grow by 13.1% in 2024, according to the World Semiconductor Trade Statistics Organization (WSTS).

Growth Drivers for PCB Products: 

PCB products are propelled by the demand from various markets, including servers and data storage, communications, new energy and smart driving, and consumer electronics. The rapid evolution of artificial intelligence and the increasing need for high computing power and high-speed networks in the ICT industry are fueling the demand for large-size, high-level, high-frequency, high-speed, high-end HDI, and high-heat dissipation PCB products. The application of AI in mobile phones, PCs, smart wearables, IoT, and other products is driving the explosive growth of edge computing capabilities and high-speed data exchange. Consequently, terminal electronic equipment requires high-frequency, high-speed, integrated, miniaturized, light and thin, and high heat dissipation PCB products.

Introducing the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm:

To meet the growing demand for high-frequency applications,Bichengpresents the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm. This innovative product combines Tg170 FR-4 and 20mil RO4003C materials to deliver exceptional performance and functionality. The key features and benefits of this hybrid PCB include:

Mixed-signal compatibility: The hybrid PCB accommodates both analog and digital signals. The FR-4 portion provides a suitable substrate for standard circuitry, while the RO4003C portion ensures excellent high-frequency performance for RF/microwave signals.

High-frequency performance: The RO4003C material exhibits low dielectric loss and excellent signal integrity properties, making it ideal for high-frequency applications. It enables efficient signal transmission while minimizing signal loss or distortion.

Thermal management: The FR-4 material in the hybrid PCB offers good thermal conductivity, aiding in effective heat dissipation. This feature is particularly valuable for applications that require robust heat management.

Design flexibility: Hybrid PCBs allow for the integration of different technologies and materials, providing greater design flexibility. Designers can optimize the layout and material selection based on the specific requirements of each section of the PCB.

Cost optimization: By selectively using RO4003C in sections that require high-frequency performance, costs can be optimized. The hybrid PCB, leveraging the cost-effective and widely available FR-4 material, offers an economical solution compared to using high-frequency materials throughout the entire board.

Compatibility and ease of manufacturing: Both Tg170 FR-4 and RO4003C are compatible withstandard PCB manufacturing processes, ensuring ease of manufacturing and compatibility with existing production lines. This allows for smooth integration of the hybrid PCB into existing production workflows.

Applications and Industries:

The 6-layer Hybrid PCB RO4003C High Tg FR-4  2.24mm is well-suited for a wide range of high-frequency applications, including:

Telecommunications: Base stations, antennas, RF modules, and wireless communication equipment.

Automotive: Advanced driver-assistance systems (ADAS), radar systems, and vehicle communication modules.

Aerospace and Defense: Radar systems, satellite communication systems, avionics, and military-grade applications.

Industrial Automation: Control systems, robotics, sensors, and high-speed data acquisition.

IoT and Wearables: Smart devices, sensors, wearables, and wireless communication modules.

Medical Devices: Imaging equipment, patient monitoring systems, and diagnostic devices.

Conclusion: 

With the global PCB industry demonstrating resilience and positive growth prospects,Bicheng is committed to providing cutting-edge solutions that meet the evolving needs of high-frequency applications. The Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm combines the benefits of Tg170 FR-4 and RO4003C materials, offering exceptional performance, design flexibility, and cost optimization. As technology advances and demands increase across various industries,Bicheng remains dedicated to delivering innovative PCB solutions that drive progress and enable the next generation of electronic devices.