The RO4360G2 high frequency PCB is the latest development in high dielectric constant PCB technology from Rogers.

The Rogers RO4360G2 material PCB is a thermoset printed circuit board that is reinforced with glass and filled with hydrocarbon ceramic. It offers a balance of performance and manufacturability that is comparable to FR-4 PCBs. These PCBs are also lead-free and have improved rigidity in multi-layer constructions, resulting in reduced material and fabrication costs.

Key Features of the RO4360G2

Let's take a closer look at some of the impressive properties of the RO4360G2:

First, let's discuss its dielectric constant. At 10 GHz and 23°C, the RO4360G2 has a dielectric constant of 6.15±0.15. This ensures reliable signal transmission and remains constant at 2.5 GHz and 23°C.

The dissipation factor, or tan delta, is incredibly low at 0.0038 at 10 GHz and 23°C. This indicates minimal signal loss and excellent performance.

The Rogers RO4360G2 PCB has a thermal conductivity of 0.75 W/mK at 50°C, allowing for efficient heat dissipation in electronic systems.

In terms of electrical properties, the RO4360G2 demonstrates high volume resistivity, measuring 4.0 x 10^13 Ω.cm at elevated temperatures. It also exhibits a surface resistivity of 9.0 x 10^12 Ω at elevated temperatures, enhancing its electrical insulation capabilities.

The electrical strength of the RO4360G2 is an impressive 784 V/mil, ensuring its durability and reliability in demanding applications.

Moving on to mechanical properties, the RO4360G2 has a tensile strength of 131 MPa (19 kpsi) in the X direction and 97 MPa (14 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C.

The flexural strength of the RO4360G2 measures 213 MPa (31 kpsi) in the X direction and 145 MPa (21 kpsi) in the Y direction after 40 hours at 50% relative humidity and 23°C.

When it comes to thermal properties, the Rogers 4360G2 PCB exhibits a coefficient of thermal expansion of 13 ppm/°C along the X axis, 14 ppm/°C along the Y axis, and 28 ppm/°C along the Z axis, from -50°C to 288°C after a replicated heat cycle.

The glass transition temperature (Tg) of the RO4360G2 is greater than 280°C.

The RO4360G2 material also has a thermal decomposition temperature (Td) of 407°C.

The RO4360G2 material showcases a T288 value of greater than 30 minutes in the Z direction, at a minimum temperature of 125°C during prebake.

With a moisture absorption of 0.08% at 50°C and 48 hours, the RO4360G2 demonstrates excellent resistance to moisture penetration.

The thermal coefficient of the dielectric constant (er) for the RO4360G2 is -131 ppm/°C at 10 GHz in the Z direction, from -50°C to 150°C.

The RO4360G2 has a density of 2.16 gm/cm³ at room temperature, providing a lightweight yet robust material for electronic applications.

The copper peel strength of the RO4360G2 measures 5.2 pli (0.91 N/mm) under Condition B.

Lastly, the RO4360G2 has achieved the V-0 rating for flammability, ensuring its resistance to ignition and flame propagation.

PCB Capability (RO4360G2)

When it comes to PCB capabilities, we offer single layer, double layer, multi-layer, and hybrid types of RO4360G2 PCBs. The thickness options range from standard measurements to non-standard variations.

The finished copper on the PCB can be 1oz, 2oz, or 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, allowing for single boards or multiple designs on one panel.

We offer a variety of solder mask colors such as green, black, blue, and yellow. Pads plating options include immersion gold, HASL, immersion silver, immersion tin, and bare copper.

A Piece of RO4360G2 PCB

Displayed on the screen is a 60 mils RO4360G2 PCB with immersion gold on pads, designed for small cell transceivers. There are 20 boards in the panel. RO4360G2 PCBs are the ideal choice for power amplifiers, patch antennas, ground-based radar, base station power amplifiers, and other RF applications.

Conclusion

RO4360G2 high frequency PCBs are compatible with automated assembly and lead-free processes. They can be combined with RO4450F prepreg and lower-Dk RO4350B,RO4003C multi-layerPCBdesigns, offering versatility and reliability for a variety of electronic applications.