In the world of high-frequency circuit materials, Rogers RT/duroid 6035HTC stands as a true innovation. Designed as a ceramic-filled PTFE composite, it offers exceptional performance and reliability for high power RF and microwave applications. With its advanced thermal conductivity and excellent drill-ability, the RT/duroid 6035HTC PCB sets a new benchmark in the industry.

Features

The 30mi RT/duroid 6035HTC PCB possesses a remarkable set of features that make it an ideal choice for demanding applications:

2.1 Dielectric Constant (DK): With a DK value of 3.5±0.05 at 10 GHz and 23°C, the RT/duroid 6035HTC ensures consistent signal integrity and reliable performance.

2.2 Dissipation Factor: The low dissipation factor of 0.0013 at 10 GHz and 23°C helps minimize signal loss and ensures efficient power transfer.

2.3 Thermal Coefficient of Dielectric Constant: The PCB exhibits a thermal coefficient of dielectric constant of -66 ppm/°C, enabling stable performance across a wide temperature range.

2.4 Moisture Absorption: The RT/duroid 6035HTC has a moisture absorption rate of just 0.06%, ensuring its reliability in various environmental conditions.

2.5 Thermal Conductivity: The board boasts a high thermal conductivity of 1.44 W/m/K at 80°C, promoting effective heat dissipation and improved reliability.

2.6 Coefficient of Thermal Expansion (CTE): With a CTE of 19 ppm/°C in the X-axis, 19 ppm/°C in the Y-axis, and 39 ppm/°C in the Z-axis, the RT/duroid 6035HTC offers excellent stability and reliability under temperature variations.

Benefits

Adopting the RT/duroid 6035HTC PCB presents numerous advantages for high-power applications:

3.1 High Thermal Conductivity: The exceptional thermal conductivity of the RT/duroid 6035HTC promotes efficient heat dissipation, resulting in lower operating temperatures and enhanced system reliability.

3.2 Improved Dielectric Heat Dissipation: The PCB's advanced composition enables superior dielectric heat dissipation, maintaining lower temperatures and reducing the risk of thermal damage to components.

3.3 Excellent High Frequency Performance: With reduced insertion loss and exceptional thermal stability of traces, the RT/duroid 6035HTC ensures reliable signal transmission and consistent performance at high frequencies.

PCB Construction Details

The RT/duroid 6035HTC Rogers PCB material is designed with careful attention to detail, ensuring optimal performance and reliability:

2-Layer Rigid PCB: The stackup consists of two copper layers, with the RT/duroid 6035HTC core layer measuring 0.762 mm (30mil).

Board Dimensions: The PCB has dimensions of 49.23mm x 55.55mm, offering a compact form factor suitable for various applications.

Minimum Trace/Space and Hole Size: The PCB supports trace widths and spacing as low as 6/5 mils, and accommodates minimum hole sizes of 0.6mm, providing design flexibility.

High-Quality Finish: The finished board thickness is 0.83mm, with an outer copper weight of 1oz (1.4 mils). The via plating has a thickness of 20μm, ensuring robust connectivity.

Surface Finish and Silkscreen: The PCB features an immersion gold surface finish for optimal solderability and corrosion resistance. The top silkscreen is white, adding clarity to component placement, while the bottom silkscreen is absent to maintain a clean aesthetic.

Rigorous Testing: Each PCB undergoes a 100% electrical test before shipment, ensuring quality and reliability.

PCB Statistics

The RT/duroid 6035HTC high frequency PCB boasts impressive statistics that reflect its versatility:

Components: The PCB supports up to 35 components, providing ample room for circuitry.

Total Pads: With a total of 112 pads, the PCB offers extensive connectivity options.

Thru Hole Pads: The PCB accommodates 74 thru-hole pads, supporting traditional component soldering.

Top SMT Pads: It provides 38 top surface mount technology (SMT) pads, enabling compact and efficient circuit designs.

Bottom SMT Pads: The RT/duroid 6035HTC PCB does not include bottom SMT pads but can be customized based on specific needs.

Vias and Nets: The PCB incorporates 64 vias and 2 nets, allowing for effective signal routing and interconnectivity.

Standard Compliance and Availability

The RT/duroid 6035HTC 30mil Rogers substrate PCB conforms to the widely accepted IPC-Class-2 standard, ensuring high-quality manufacturing and assembly. It is available worldwide, making it easily accessible for engineers and manufacturers alike.

Applications

The versatile nature of the RT/duroid 6035HTC high frequency circuit board facilitates its use in various applications, including:

High Power RF and Microwave Amplifiers: The PCB's exceptional thermal conductivity and high-frequency performance make it an ideal choice for high-power amplifiers.

Power Amplifiers, Couplers, Filters, Combiners, Power Dividers: Whether it's designing robust couplers, precise filters, efficient combiners, or reliable power dividers, the RT/duroid 6035HTC PCB ensures optimal performance and reliability.

Conclusion

With its advanced properties and exceptional performance, the RT/duroid 6035HTC Rogers PCB sets a new standard for high power RF and microwave applications. From its superior thermal conductivity to its excellent high-frequency performance, this PCB empowers engineers to create reliable, efficient, and high-performing circuitry. By leveraging the Rogers 6035HTC PCB, engineers gain a competitive edge in the demanding world of high-frequency.