The exact composition and materials used in the RO3000 series may vary depending on the specific product within the series. However, in general, the materials in the RO3000 series circuit boards typically consist of a high-frequency laminate composed of woven glass reinforced hydrocarbon/ceramics. These laminates are known for their low dielectric constant, low loss tangent, and excellent thermal stability.

The specific product grades within the RO3000 series, such as RO3003, RO3010, RO3035, and others, may have slight variations in their composition to meet different performance requirements. For instance, some grades may have specific fillers or additives to optimize certain characteristics or offer specialized features.

To obtain the detailed information about the specific composition and materials used in a particular product within the RO3000 series, it is best to consult the product datasheet or contact Rogers Corporation directly for accurate and up-to-date.

Introduction

Welcome to our deep dive into the world of RO3003 high-frequency laminates, a cutting-edge solution engineered to transform commercial microwave and RF applications. In this comprehensive product description, we will explore the remarkable features, benefits, construction details, statistics, and typical applications of the Rogers RO3003 with 3 layer PCB, providing you with the insights needed to harness its full potential and revolutionize your designs.

The Power of RO3003

RO3003 laminates, developed by Rogers Corporation, combine ceramic-filled PTFE composites to create a high-performance material tailor-made for high-frequency applications. This advanced laminate offers exceptional stability of dielectric constant (Dk) across a wide range of temperatures and frequencies, surpassing the limitations of traditional PTFE glass materials. With its remarkable properties and the ability to operate at up to 77 GHz,Rogers3003 is ideally suited for automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave) applications.

Features that Define Excellence

Let's dive into the key features that set Roger 3003 apart from the competition:

1.Rogers RO3003 Ceramic-Filled PTFE Composites:

By leveraging the power of ceramic fillers within a PTFE matrix, RO3003 achieves outstanding performance in high-frequency applications.

2.Stable Dielectric Constant (Dk):

RO3003 boasts a dielectric constant of 3+/-0.04 at 10 GHz/23°C, ensuring consistent electrical performance over a wide range of temperatures and frequencies.

3.Minimal Dissipation Factor (Df):

With a dissipation factor of 0.001 at 10 GHz/23°C, RO3003 minimizes signal loss and ensures high transmission fidelity.

4.Outstanding Thermal Stability:

RO3003 excels in harsh environments, with a high glass transition temperature (Td > 500°C) and excellent thermal conductivity of 0.5 W/mK.

5.Moisture Absorption Resistance:

RO3003 exhibits minimal moisture absorption at 0.04%, ensuring stability and reliability in humid conditions.

6.Thermally Compatible Coefficient of Thermal Expansion (CTE):

RO3003 presents a low in-plane expansion coefficient (X: 17 ppm/°C, Y: 16 ppm/°C, Z: 25 ppm/°C), matching copper and guaranteeing reliable surface-mounted assemblies.

Unleashing the Benefits

Discover how the extraordinary properties of RO3003 translate into various benefits for your high-frequency designs:

1.High-Frequency Capability:

With low dielectric loss and the ability to operate at frequencies up to 77 GHz, RO3003 empowers your designs with unparalleled performance in high-frequency applications.

2.Mechanical Stability:

RO3003 maintains excellent mechanical properties across a wide temperature range, ensuring the integrity and reliability of your circuits in demanding environments.

3.Versatile Stackup Options:

The uniform mechanical properties of RO3003 make it an ideal choice for multi-layer board designs with varying dielectric constants. It seamlessly integrates with epoxy glass multi-layer board hybrid designs to provide optimal performance.

4.Stable Electrical Performance:

RO3003's dielectric constant stability across temperature and frequency guarantees consistent electrical performance, making it perfect for applications such as bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.

5.Dimensional Stability:

RO3003 exhibits excellent dimensional stability, ensuring reliable and accurate manufacturing processes for intricate designs.

6.Cost-Effective Solution:

RO3003 presents an economical laminate pricing, enabling cost-effective high-frequency PCB manufacturing without compromising on quality or performance.

Construction Details

Now, let's explore the construction details of the 30mil RO3003 material PCB you have received:

PCB Stackup: This PCB consists of a 3 layer PCB stackup.

Copper Layer 1: 35μm thickness.

Rogers RO3003 Substrate: 30mil (0.762mm) thickness.

Copper Layer 2: 35μm thickness.

RO4450F Bondply: 4mil (0.102mm) thickness.

Rogers RO3003 Substrate: 30mil (0.762mm) thickness.

Copper Layer 3: 35μm thickness.

Finished Board Thickness: 1.7mm.

Finished Copper Weight: 1 oz (1.4 mils) outer layers.

Via Plating Thickness: 20μm.

Surface Finish: Bare copper.

Top Silkscreen: No.

Bottom Silkscreen: No.

Top Solder Mask: No.

Bottom Solder Mask: No.

100% Electrical Test: All boards are thoroughly tested before shipment to ensure their electrical integrity.

PCB Statistics

Let's explore the statistical attributes of the RO3003RogersPCB you have received:

Components: This PCB accommodates 35 components.

Total Pads: The board incorporates a total of 68 pads.

Thru-Hole Pads: The board features 47 thru-hole pads.

Top SMT Pads: There are 21 top surface mount technology (SMT) pads.

Bottom SMT Pads: There are no bottom SMT pads.

Vias: The board includes 51 vias.

Nets: The design encompasses 4 interconnected nets.

Artwork Format:The supplied artwork follows the Gerber RS-274-X format.

Accepted Standard:The PCB adheres to the IPC-Class-2 standard.

Availability: This high-performance PCB is available worldwide, catering to your design needs no matter your location.

Applications Galore

RO3003 unlocks a world of possibilities across diverse applications, including but not limited to:

1)Automotive Radar:

RO3003 is perfectly suited for automotive radar applications, ensuring accurate object detection, collision avoidance, and enhanced road safety.

2)Global Positioning Satellite (GPS) Antennas:

With its exceptional performance, RO3003 is an ideal choice for GPS antennas, offering reliable positioning and navigation capabilities.

3)Cellular Telecommunications Systems:

RO3003 serves as a reliable foundation for power amplifiers and antennas in cellular telecommunications systems, enabling seamless wireless communication.

4)Patch Antennas for Wireless Communications:

Utilizing RO3003, patch antennas deliver high-gain, wideband, and efficient wireless communication in various devices.

5)Direct Broadcast Satellites (DBS):

RO3003 facilitates the transmission and reception of satellite signals, enabling high-quality video, audio, and data delivery.

6)Datalink on Cable Systems:

RO3003 ensures robust and efficient datalink on cable systems, allowing for reliable data transmission in demanding environments.

7)Remote Meter Readers:

With its exceptional stability and reliability, RO3003 is an excellent choice for remote meter readers, facilitating accurate and efficient data collection.

8)Power Backplanes:

RO3003 enables the creation of robust and efficient power backplanes, ensuring reliable power distribution in complex electronic systems.

Conclusion

The RO3003 high frequency PCB represents a significant leap forward in high-frequency laminates, empowering your designs with unmatched stability, reliability, and performance. By exploiting advanced ceramic-filled PTFE composites, RO3003 Rogers PCB establishes new benchmarks in high-frequency applications. With its exceptional features, benefits, construction details, and versatility, RO3003 proves to be the go-to choice for automotive radar, GPS antennas, cellular telecommunications systems, and more. Embrace the power of RO3003 to unlock unparalleled design possibilities and revolutionize the future of high PCBs.