The TU-768 material PCB is an exceptional high-Tg (glass transition temperature) and high thermal reliability laminate developed by Taiwan Union. It is accompanied by the TU-768P matching prepreg, offering a comprehensive solution for your PCB needs. The TU-768 laminate sand prepregs are crafted from top-quality woven E-glass coated with an epoxy resin system. This combination provides the laminates with remarkable UV-blocking characteristics and compatibility with automated optical inspection (AOI) processes. These products are specifically designed for applications that require the ability to withstand severe thermal cycles or undergo extensive assembly work. TU-768 laminates exhibit excellent coefficient of thermal expansion (CTE), superior chemical resistance, thermal stability, and CAF (Conductive Anodic Filament) resistance properties.

Features:

The TU-768 PCB boasts an array of noteworthy features that make it an ideal choice for demanding applications:

1)Dk of 4.3 at 10GHz: The dielectric constant ensures efficient signal transmission and reduced signal loss at high frequencies.

2)Dissipation factor of 0.0023 at 10GHz: The low dissipation factor minimizes energy loss and enhances signal integrity.

3)CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C: The coefficient of thermal expansion matches that of copper, reducing the risk of delamination and ensuring dimensional stability.

4)Coefficient of thermal expansion matched to copper: The matched CTE between the TU-768 PCB and copper enhances the reliability of the circuit board assembly.

5)Decomposition Temperature (Td) of 350°C TGA: The high decomposition temperature ensures the PCB's thermal stability even under extreme operating conditions.

6)Tg (DSC) of 180°C: The high glass transition temperature guarantees excellent mechanical strength and dimensional stability.

7)T260 > 60 min, T288 > 15 min, T300 > 2 min: The high glass transition temperature ensures reliable performance during soldering and assembly processes.

Benefits:

The TU-768 printed circuit board offers several advantages that set it apart from conventional circuit boards:

1)Lead-Free Process Compatible: The PCB is fully compatible with lead-free soldering processes, ensuring compliance with environmental regulations.

2)Excellent Coefficient of Thermal Expansion: The matched CTE with copper prevents thermal stress and ensures long-term reliability, even in challenging thermal environments.

3)Anti-CAF Property: The TU-768 PCB exhibits outstanding resistance to Conductive Anodic Filament (CAF) formation, reducing the risk of electrical failures.

4)Superior Chemical and Thermal Resistance: The laminates and prepregs used in TU-768 PCB demonstrate exceptional resistance to chemicals and heat, ensuring prolonged durability and reliability.

5)Fluorescence for AOI: The UV-block characteristic and compatibility with automated optical inspection (AOI) processes make the PCB highly suitable for inspection and quality control.

6)Moisture Resistance: The TU-768 PCB is designed to withstand moisture and humidity, minimizing the risk of electrical failures in demanding environments.

PCB Stackup and Construction Details:

The TU-768 PCB is a 2-layer rigid PCB with the following stackup and construction details:

Copper Layer 1: 35μm

TU-768 Core: 0.76mm

Copper Layer 2: 35μm

PCB Statistics:

The TU-768 PCB exhibits the following statistics:

• Components: The PCB supports up to 11 components, allowing for versatile and complex circuit designs.
• Total Pads: There are a total of 24 pads available for component attachment.
• Thru-Hole Pads: The PCB provides 15 thru-hole pads for through-hole component placement.
• Top SMT Pads: There are 9 surface-mount technology (SMT) pads available on the top side for SMT component attachment.
• Bottom SMT Pads: The bottom side of the PCB does not include any SMT pads.
• Vias: The PCB features 7 vias, facilitating interconnection between different layers and ensuring signal integrity.
• Nets: The PCB supports 2 nets, enabling the routing of electrical signals between components and ensuring proper functionality.

Artwork and Quality Standard:

The TU-768 PCB utilizes Gerber RS-274-X artwork format, a widely accepted industry standard for PCB manufacturing. It adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing processes and reliable performance.

Availability: The TU-768 high Tg material PCB is available worldwide, making it accessible to customers across different regions.

Typical Applications:

The TU-768 PCB finds application in various industries and sectors, including:

1.Consumer Electronics: The PCB's high-Tg, thermal reliability, and moisture resistance make it suitable for consumer electronic devices such as smartphones, tablets, and wearables.

2.Server and Workstations: The PCB's superior thermal stability and chemical resistance make it ideal for server and workstation applications that demand high performance and reliability.

3.Automotive: The TU-768 PCB's ability to withstand severe thermal cycles and resistance to CAF formation make it suitable for automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).

In conclusion, the TU-768 PCB offers a high-Tg and high thermal reliability solution for your circuit board needs. With its excellent CTE, lead-free process compatibility, anti-CAF property, superior chemical and thermal resistance, and fluorescence for AOI, it ensures long-term reliability and performance in demanding applications. Whether in consumer electronics, server and workstation systems, or automotive applications, the TU-768 0.8mm PCB delivers exceptional quality and functionality. Its availability worldwide and adherence to IPC-Class-2 quality standards further enhance its appeal as a reliable and versatile PCB solution.