Introduction

The Taconic RF-60TC PCB is meticulously engineered to cater to the stringent demands of high-power RF and microwave applications. Its ceramic-filled, glass-reinforced PTFE laminate not only ensures lower operating temperatures but also enhances gains and efficiencies in miniaturized antenna designs, thanks to improved dielectric heat dissipation and remarkably low dielectric losses.

What are the key advantages of using RF-60TC in high power amplifiers?

Using 10mil RF-60TC Taconic PCB materials in high-power amplifiers offers a multitude of advantages due to its unique properties tailored for demanding RF and microwave applications. Here are the key advantages of utilizing RF-60TC in high-power amplifiers:

1)Glass Reinforced PTFE Ceramic Composites: Combining the best of both worlds, this material offers exceptional strength and thermal conductivity.

2)Dielectric Constant (Dk) of 6.15 at 10 GHz: Ensures stable and reliable performance in high-frequency environments.

3)Dissipation Factor of 0.002 at 10 GHz/23°C: Minimizes signal loss and ensures optimal transmission efficiency.

4)Thermal Coefficient of Dk: With a range from -50°C to 150°C, this material maintains stability across varying temperature conditions.

5)Low Moisture Absorption: At just 0.03%, the RF-60TC PCB remains resilient in humid environments.

6)High Thermal Conductivity:With values ranging from 0.9 to 1.05 W/M*K, this PCB facilitates efficient heat dissipation.

7)CTE X-axis, Y-axis, Z-axis:The low coefficients of thermal expansion ensure dimensional stability and reliability.

8)Improved Loss Tangent: Enhances signal integrity and reduces transmission losses.

9)High Thermal Conductivity: Efficiently dissipates heat, improving overall performance.

10)Enhanced Dimensional Stability: Ensures consistent performance over time.

11)Excellent Adhesion to Metal: Facilitates reliable connections and reduced insertion loss.

12)Stable DK over Frequency and Temperature: Maintains performance consistency across diverse operating conditions.

13)Low Moisture Absorption: Guarantees reliability in varying environmental conditions.

PCB Stackup and Construction Details

2-Layer Rigid PCB: Copper_layer_1 - 35μm, RF-60TC - 0.254 mm (10mil), Copper_layer_2 - 35μm.

Board Dimensions: 49.44mm x 36.88mm, allowing for versatile applications.

Minimum Trace/Space: 4/5 mils, catering to intricate designs.

Minimum Hole Size: 0.25mm, enabling precise component placement.

Finished Board Thickness: 0.37mm, balancing durability and flexibility.

Finished Cu Weight: 1 oz (1.4 mils) outer layers, ensuring robustness.

Via Plating Thickness: 20μm, facilitating reliable connections.

Surface Finish: Immersion Tin, enhancing durability and conductivity.

100% Electrical Test: Ensures quality and reliability prior to shipment.

PCB Statistics

Components: 10, offering versatility in design.

Total Pads: 23, catering to various connections.

Thru Hole Pads: 14, facilitating robust through-hole connections.

Top SMT Pads: 9, suitable for surface-mount components.

Bottom SMT Pads: 0, maintaining design simplicity.

Vias: 17, ensuring efficient signal routing.

Nets: 2, optimizing signal integrity.

Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X, ensuring compatibility and precision.

Accepted Standard: IPC-Class-2, meeting industry benchmarks for quality and reliability.

Availability: Worldwide, making this cutting-edge technology accessible globally.

Typical Applications

The RF-60TC 10mil Taconic laminates PCB finds its place in a variety of high-performance applications, including:

High Power Amplifiers

Miniaturized Antennas

GPS, Patch, RFID Reader Systems

Filters, Couplers & Dividers

Satellite Communication Systems

Conclusion

In conclusion, the RF-60TC Taconic PCB stands at the forefront of innovation in high-frequency materials, offering a blend of superior performance, reliability, and design flexibility. With its advanced features, benefits, and construction details, this 10mil Taconic substrate PCB sets a new standard for high-power RF and microwave applications, ensuring optimal performance and longevity in a wide array of cutting-edge technologies.