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Introducing RO3003 PCB: Delivering High Performance and Reliability
Item NO.:
BIC-235-v258.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3003 PCB Rogers 3003 30mil High Frequency Material 2-layers
We are excited to present the newly shipped RO3003 PCB, a cutting-edge solution that combines advanced technology with exceptional performance. Designed to meet the demands of high-frequency applications, the RO3003 PCB offers outstanding electrical properties, dimensional stability, and ease of manufacturing. In this article, we will delve deep into the features, specifications, and applications of this remarkable PCB.
PCB Substrates: Unmatched Material Properties
The RO3003 30mil PCB is constructed using Rogers RO3003 ceramic-filled PTFE composites, ensuring superior performance across a wide range of applications. With a dielectric constant of 3.0+/- 0.04 at 10 GHz/23°C and a dissipation factor of 0.001 at 10 GHz/23°C, this PCB enables low dielectric loss, making it suitable for use in applications up to 77 GHz. Additionally, the RO3003 substrate exhibits a Td> 500°C, ensuring excellent thermal stability. Its thermal conductivity of 0.5 W/mK facilitates efficient heat dissipation, further enhancing the reliability of the PCB. With a moisture absorption rate of just 0.04%, the RO3003 PCB offers exceptional resistance to environmental factors. The coefficient of thermal expansion (-55 to 288 °C) ensures dimensional stability, with values of X axis 17 ppm/°C, Y axis 16 ppm/°C, and Z axis 25 ppm/°C.
Features & Benefits: Unmatched Performance and Versatility
The Rogers RO3003 PCB offers numerous features and benefits that make it an ideal choice for a wide range of applications:
1.Low dielectric loss: The RO3003 PCB's low dielectric loss allows for applications up to 77 GHz, making it perfect for high-frequency designs.
2.Uniform mechanical properties:With its diverse range of dielectric constants, this PCB is suitable for multi-layer board designs requiring varying dielectric constants.
3.Stable dielectric constant: The RO3003 PCB maintains a stable dielectric constant over temperature and frequency variations, making it ideal for band pass filters, microstrip patch antennas, and voltage-controlled oscillators.
4.Low in-plane expansion coefficient: The PCB's low in-plane expansion coefficient, matching that of copper, ensures reliable surface-mounted assemblies, making it suitable for applications sensitive to temperature fluctuations.
5.Volume manufacturing process: The RO3003 0.762mm substrate PCB benefits from an economical laminate pricing structure, allowing for cost-effective production.
Stackup: Simplified Design and Manufacturing Process
The 2-layer Rogers RO3003 PCB is a rigid board with the following stackup:
Copper_layer_1: 35 μm
Rogers RO3003 Substrate: 30mil (0.762mm)
Copper_layer_2: 35 μm
Construction Details: Precision and Reliability
RO3003 PCB typical values:
RO3003 Typical Value |
|||||
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.06 |
X |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
107 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
930 |
X |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.04 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.9 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.5 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion |
17 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
12.7 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|
The construction details of the RO3003 PCB are as follows:
Construction Details |
Value |
Board dimensions |
45mm x 54.3 mm |
Minimum Trace/Space |
5/6 mils |
Minimum Hole Size |
0.3mm |
Blind vias |
No |
Finished board thickness |
0.88mm |
Finished Cu weight |
1 oz (1.4 mils) |
Via plating thickness |
20 μm |
Surface finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Electrical test |
100% prior to shipment |
To provide you with an overview of the PCB's specifications, here are the statistics for the RO3003 PCB:
PCB Statistics |
Value |
Components |
27 |
Total Pads |
61 |
Thru Hole Pads |
35 |
Top SMT Pads |
26 |
Bottom SMT Pads |
0 |
Vias |
41 |
Nets |
3 |
Artwork Format and Standards
The Rogers 3003 PCB is supplied in Gerber RS-274-X format and adheres to the IPC-Class-2 standard, ensuring compatibility and reliability in your designs.
Availability: Worldwide
We are pleased to offer the RO3003 PCB worldwide, enabling our customers to access this high-performance solution regardless of their location.
Typical Applications: Unleash the Potential
The RO3003 PCB finds its application in various industries and scenarios, enabling high-performance solutions across multiple domains:
1.Automotive radar applications: Perfect for automotive radar operating at 77 GHz, supporting advanced driver assistance systems (ADAS) in modern vehicles.
2.Global positioning satellite antennas: Ensures reliable signal transmission for GPS antennas, guaranteeing accurate positioning.
3.Cellular telecommunications systems: Ideal for power amplifiers and antennas in cellular communication systems, ensuring seamless connectivity.
4.Patch antenna for wireless communications: Enables efficient wireless communication in varioussettings, supporting the development of patch antennas for improved signal transmission.
5.Direct broadcast satellites: Ensures reliable data transmission in direct broadcast satellite systems, providing a seamless viewing experience.
6.Datalink on cable systems: Facilitates efficient data transmission in cable systems, ensuring fast and reliable communication.
7.Remote meter readers: Enables accurate and reliable remote meter reading systems, enhancing efficiency and convenience.
8.Power backplanes: Supports the development of power backplanes, ensuring efficient power distribution in electronic systems.
Technical Support: Contact Us for Expert Assistance
If you have any technical questions or require further information about the RO3003 PCB, our dedicated team is ready to assist you. Please feel free to reach out to us at sales20@bichengpcb.com, and our experienced sales representatives will provide you with the necessary support.
In conclusion, the newly shipped RO3003 high frequency PCB offers exceptional performance, reliability, and versatility. With its advanced material properties, stable dielectric constant, and low in-plane expansion coefficient, this PCB is perfect for high-frequency applications requiring precise and reliable signal transmission. Its simplified stackup and construction details further enhance its usability, while its availability worldwide ensures accessibility for customers across the globe. Explore the possibilities with the RO3003 PCB and unlock the potential for innovation in your designs.
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