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The Rogers TMM4 PCB 30mil encapsulates innovation and reliability, making it a cornerstone for high-frequency applications across diverse industries.
Item NO.:
BIC-269-v335.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TMM4 PCB 30mil 0.762mm 2-layer High Frequency Circuit Board
In the realm of high-frequency applications where precision, reliability, and performance are paramount, the TMM4 30mil PCB stands out as a cutting-edge solution. Crafted from a ceramic, hydrocarbon, and thermoset polymer composite, this PCB material embodies the pinnacle of technological innovation, offering a perfect blend of superior mechanical and chemical properties.
Introduction of TMM4
The Rogers TMM4 thermoset microwave material represents a breakthrough in microwave engineering. Designed specifically for high plated-thru-hole reliability strip-line and micro-strip applications, TMM4 materializes in the field of high-frequency circuitry. Drawing strength from its unique composition, these laminates seamlessly integrate the advantages of ceramics and traditional PTFE laminates without the need for specialized production techniques, setting new industry standards for efficiency and reliability.
Features
1)Dielectric Properties:
With a dielectric constant (Dk) of 4.50 +/- .045, the TMM4 PCB ensures precise signal integrity.
2)Low Loss Design:
A dissipation factor of .0020 at 10GHz minimizes signal loss, guaranteeing optimal performance.
3)Thermal Stability:
Boasting a thermal coefficient of Dk of 15ppm/°K and a matched coefficient of thermal expansion to copper, the TMM4 PCB remains stable across varying temperatures.
4)Robust Construction:
The PCB's thermal conductivity of 0.7 W/mk and Decomposition Temperature (Td) of 425°C TGA ensure resilience under demanding conditions.
5)Moisture Resistance:
With a moisture absorption rate of 0.07%-0.18%, the TMM4 PCB maintains its structural integrity in diverse environments.
6)Versatile Thickness Range:
Available in thicknesses ranging from .0015 to .500 inches, providing flexibility for various applications.
Benefits
1)Mechanical Durability:
Resistant to creep and cold flow, the TMM4 Rogers substrate PCB guarantees long-term stability.
2)Chemical Resistance:
Withstanding process chemicals, it minimizes damage during fabrication processes.
3)Reliability:
Based on a thermoset resin, the TMM4 PCB enables secure wire-bonding and ensures high reliability of plated through holes.
4)Compatibility:
Seamlessly integrates with common PWB processes, offering versatility and ease of use.
TMM4 PCB Stackup
2-layer rigid PCB
Copper_layer_1 - 35μm
Rogers TMM4 Core - 0.762 mm (30mil)
Copper_layer_2 - 35μm
PCB Construction Details
Description |
Value |
Board dimensions |
192mm x 115mm = 1PCS, +/- 0.15mm |
Minimum Trace/Space |
5/7 mils |
Minimum Hole Size |
0.5mm |
Blind vias |
No |
Finished board thickness |
0.8mm |
Finished Cu weight |
1oz (1.4 mils) outer layers |
Via plating thickness |
20 μm |
Surface finish |
Immersion Gold |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Electrical test |
100% prior to shipment |
PCB Statistics
Description |
Value |
Components |
37 |
Total Pads |
219 |
Thru Hole Pads |
174 |
Top SMT Pads |
45 |
Bottom SMT Pads |
0 |
Vias |
211 |
Nets |
5 |
Additional Details
Artwork Supplied: Gerber RS-274-X.
Accepted Standard: IPC-Class-2.
Availability: Worldwide.
Typical Applications
RogersTMM4 finds its niche in a myriad of applications, including:
RF and microwave circuitry.
Power amplifiers and combiners.
Filters and couplers.
Satellite communication systems.
Global Positioning Systems Antennas.
Patch Antennas.
Dielectric polarizers and lenses.
Chip testers.
Conclusion
In conclusion, the Rogers TMM4 PCB 30mil encapsulates innovation and reliability, making it a cornerstone for high-frequency applications across diverse industries. With a blend of cutting-edge technology and meticulous craftsmanship, this PCB in high frequency circuit board PCB market stands as a testament to excellence in modern engineering.
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