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Home Newly Shipped RF PCB Hybrid PCB of RT/duroid 5880 and RO4003C 4-layer 1.33mm Thick Hybrid Multilayer Circuit Board

Hybrid PCB of RT/duroid 5880 and RO4003C 4-layer 1.33mm Thick Hybrid Multilayer Circuit Board


The Hybrid PCB of Rogers RO5880 and RO4003C is a cutting-edge solution that combines the superior characteristics of both materials to deliver exceptional performance in high-frequency applications.





  • Item NO.:

    BIC-272-v338.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



Hybrid PCB of RT/duroid 5880 and RO4003C 4-layer 1.33mm Thick Hybrid Multilayer Circuit Board

 

Introduction

The Hybrid PCB of Rogers RO5880 and RO4003C is a cutting-edge solution that combines the superior characteristics of both materials to deliver exceptional performance in high-frequency applications. This four-layer rigid PCB offers a robust construction and precise control over its electrical properties, making it an ideal choice for demanding industries such as aerospace, telecommunications, and military.

 

RT/duroid 5880

The RT/duroid 5880 laminate is a remarkable high-frequency material composed of PTFE composites reinforced with glass microfibers. This unique composition results in a low dielectric constant (Dk) and minimal dielectric loss, ensuring efficient signal transmission at high frequencies. The random orientation of glass microfibers within the PTFE composites contributes to the uniformity of the dielectric constant, further enhancing its performance.

 

RO4003C

Rogers RO4003C is another innovative material in the hybrid PCB that offers outstanding electrical performance and manufacturability. It utilizes proprietary woven glass reinforced hydrocarbon/ceramics, which combines the electrical properties of PTFE/woven glass with the manufacturing benefits of epoxy/glass composites. This material ensures precise control over the dielectric constant (Dk) and low loss, all while utilizing a cost-effective production process.


Hybrid PCB Rogers RO5880 and RO4003C

 

Features of RT/duroid 5880

The Rogers duroid 5880 exhibits a set of impressive features that make it an excellent choice for high-frequency applications:

 

-Low dielectric constant (Dk) of 2.2 with a tight tolerance of 0.02 at 10GHz/23°C.

-Minimal dissipation factor of 0.0009 at 10GHz, contributing to low signal loss.

-Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C, providing stability under varying temperature conditions.

-Extremely low moisture absorption of 0.02%, ensuring consistent electrical performance.

-Isotropic nature, allowing uniform properties in all directions.

-Coefficient of Thermal Expansion (CTE) in the X-axis of 31 ppm/°C, Y-axis of 48 ppm/°C, and Z-axis of 237 ppm/°C.

 

Features of RO4003C

Rogers RO4003C offers a host of remarkable features, making it an exceptional choice for high-frequency applications:

 

-Consistent dielectric constant (DK) of 3.38 +/-0.05 at 10GHz, allowing precise signal control.

-Low dissipation factor of 0.0027 at 10GHz, ensuring minimal signal loss.

-Impressive thermal conductivity of 0.71 W/m/°K, aiding in heat dissipation.

-Thermal coefficient of dielectric constant (+40 ppm/°C, ranging from -50°C to 150°C), maintaining stable electrical performance across temperature variations.

-Maintained CTE to copper with X-axis of 11ppm/°C and Y-axis of 14ppm/°C, reducing the risk of delamination or stress-related issues.

-Low Z-axis coefficient of thermal expansion at 46 ppm/°C, contributing to the PCB's dimensional stability.

-High glass transition temperature (Tg) exceeding 280°C.

-Minimal moisture absorption of 0.06%, ensuring consistent electrical performance in humid environments.

 

PCB Stackup and Construction Details

The hybrid PCB has a 4 layer pcb stackup construction designed to meet the demanding requirements of high-frequency applications. The stackup consists of copper layers,duroid 5880,prepreg bondply, RO4003C, and another copper layer. The key details of the construction are as follows:

 

PCB Stackup

Layer

Material

Thickness (mm)

Thickness (mil)

Copper Weight (μm)

Copper_layer_1

Copper

0.035

-

35

RT/duroid 5880

RT/duroid 5880

0.787

31

-

Copper_layer_2

Copper

0.035

-

35

RO4450F

RO4450F Prepreg

0.101

4

-

Copper_layer_3

Copper

0.203

-

35

RO4003C

RO4003C

0.203

8

-

Copper_layer_4

Copper

0.035

-

35

 

 

Construction Details

Parameter

Value

Board Dimensions

110mm x 51mm=1PCS, +/- 0.15mm

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.3mm

Blind Vias

No

Finished Board Thickness

1.3mm

Finished Cu Weight

1oz (1.4 mils) inner/outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Electrical Test

100% Electrical test used prior to shipment

 

 

PCB Statistics

Statistic

Value

Components

41

Total Pads

85

Thru Hole Pads

54

Top SMT Pads

31

Bottom SMT Pads

0

Vias

52

Nets

5

 

 

Compatibility and Artwork

The Hybrid multilayer printed circuit board PCB of RT 5880 and RO4003C adheres to the Gerber RS-274-X standard, ensuring seamless compatibility with various PCB design tools. It complies with the IPC-Class-2 standard, guaranteeing high-quality manufacturing and reliability standards. Additionally, this PCB is available worldwide, enabling easy access for customers globally.

 

Typical Applications 

The versatility and outstanding electrical performance of the hybrid circuit materials PCB make it suitable for various demanding applications, including:

 

-Commercial Airline Broadband Antennas

-Microstrip and Stripline Circuits

-Millimeter Wave Applications

-Radar Systems

-Guidance Systems 

-Point to Point Digital Radio Antennas

 

Conclusion

In conclusion, the Hybrid 4 layer PCBs of Rogers 5880 and RO4003C combines the exceptional properties of both materials to deliver superior performance in high-frequency applications. With precise control over electrical characteristics, remarkable thermal stability, and reliable construction, this hybrid circuit board stands as a reliable choice for industries requiring high-speed, high-reliability solutions. Backed by worldwide availability and conformity to industry standards, it meets the evolving needs of modern technologies with unwering excellence.




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