RO4350B PCB 6.5mm Thick Rogers 4350B 2 Layer Circuit Board RO4450F Bondply ENIG

RO4350B PCB 6.5mm Thick Rogers 4350B 2 Layer Circuit Board RO4450F Bondply ENIG

Introduction

The RO4350B PCB is a high-quality, two-layer printed circuit board designed to meet the demanding requirements of modern electronic devices. It utilizes Rogers RO4350B laminates, which are proprietary woven glass reinforced hydrocarbon/ceramics with excellent electrical performance and manufacturability. This PCB offers a cost-effective solution with tight control over the dielectric constant (Dk), low loss, and reliable performance. It does not require special treatments or handling procedures, making it a highly versatile option for various applications.

RO4350B and RO4450F

The Rogers 4350B material used in this PCB provides exceptional dimensional stability and a low coefficient of thermal expansion (CTE) similar to that of copper. This characteristic ensures reliable plated through-hole quality, even in extreme thermal shock environments. With a high glass transition temperature (Tg) of over 280°C (536°F),RO4350B exhibits stable expansion characteristics throughout the entire circuit processing temperature range. Additionally, RO4350B material is UL 94 V-0 rated, making it suitable for active devices and high power RF designs.

The RO4450F bondply used in the PCB is a high-performance material compatible with the RO4000 series core materials. It offers excellent lateral flow capability and is designed for multi-layer constructions that require sequential laminations. The bondply possesses a high postcure Tg, allowing it to handle multiple lamination cycles effectively. Its compatibility with low-flow FR-4 bondply enables non-homogeneous multi-layer constructions using a single bond cycle, making it a versatile choice for complex designs.

Features of RO4350B

The Rogers RO4350B material offers several key features that make it an excellent choice for a wide range of applications:

1)Dielectric Constant (DK):

The DK of RO4350B is 3.48 +/- 0.05 at 10GHz/23°C. This controlled dielectric constant ensures predictable electrical performance.

2)Dissipation Factor:

With a low dissipation factor of 0.0037 at 10GHz/23°C, RO4350B minimizes signal loss and distortion, ensuring high signal integrity.

3)Thermal Conductivity:

The PCB's thermal conductivity is 0.69 W/m/°K, facilitating heat dissipation and maintaining optimal temperature levels.

4)Coefficient of Thermal Expansion (CTE):

RO4350B exhibits a low Z-axis CTE of 32 ppm/°C, providing dimensional stability and reliable plated through-hole quality in severe thermal shock applications.

5)High Tg Value:

RO4350B has a high glass transition temperature (Tg) of more than 280°C, ensuring stable performance across a wide temperature range.

6)Low Water Absorption: 

The material has a low water absorption rate of 0.06%, making it suitable for applications in humid environments.

Features of RO4450F

The RO4450F bondply offers the following features:

1)Dielectric Constant (DK):

The DK of RO4450F is 3.52 +/- 0.05 at 10GHz/23°C, providing predictable electrical performance.

2)Dissipation Factor: 

RO4450F has a low dissipation factor of 0.004 at 10GHz/23°C, minimizing signal loss and maintaining signal integrity.

3)Thermal Conductivity:

The bondply's thermal conductivity is 0.65 W/m/°K, contributing to effective heat management.

4)Coefficient of Thermal Expansion (CTE):

RO4450F exhibits a Z-axis CTE of 50 ppm/°C, ensuring stability and reliability during thermal cycling.

5)High Tg Value:

Similar to RO4350B, RO4450F has a high Tg value of over 280°C, ensuring stability across a broad temperature range.

6)Low Water Absorption:

The bondply's low water absorption rate of 0.09% ensures reliable performance even in humid environments.

PCB Stackup and Construction

The Rogers RO4350B PCB 2-layer construction is designed for optimal performance and reliability. The stackup consists of the following layers:

PCB Stackup

The finished board thickness is 6.5 mm, providing robustness and durability. The use of multiple layers of RO4350B material and RO4450F ensures excellent performance and dimensional stability in mixed dielectric multi-layer board constructions. The PCB is manufactured to strict quality standards and undergoes a 100% electrical test to ensure its reliability before shipment.

PCB Construction

PCB Specifications and Statistics

The RO4350B high frequency PCB meets various specifications to accommodate diverse application requirements:

Typical Applications

The RO4350B PCB finds applications in various industries and projects, including:

Cellular Base Station Antennas and Power Amplifiers

RF Identification Tags

Automotive Radar and Sensors

LNBs for Direct Broadcast Satellites

Conclusion

The RO4350B PCB 2-layer 6.5mm Thick is a high-quality and reliable solution for various electronic applications. With its advanced RO4350B and RO4450F materials, the PCB offers outstanding electrical performance, low loss, and dimensional stability. It meets strict quality standards and specifications, making it a versatile choice for a wide range of industries. Whether used in cellular base stations, RF identification tags, automotive radar systems, or satellite applications, this Rogers PCB provides optimal performance and durability. With worldwide availability and adherence to IPC-Class-2 quality standards, the RO4350B PCB is a dependable solution for your electronic needs.