Hybrid PCB of RO4003C and FR-4 6 Layer PCB Stackup 1.1mm Thick Multilayer Circuit Board

Hybrid PCB of RO4003C and FR-4 6Layer PCB Stackup 1.1mm Thick Multilayer Circuit Board

The Hybrid PCB of RO4003C and FR-4 offers exceptional performance and reliability for a wide range of applications. This 6 laye rPCB stackup combines the advantages of Rogers RO4003C material and FR-4 substrate, providing excellent electrical properties and manufacturability. With its unique composition and well-designed construction, this PCB is suitable for various industries including aerospace, telecommunications, and radar systems.

Introduction of RO4003C:

Rogers RO4003C materials are an innovative combination of woven glass reinforced hydrocarbon/ceramics, offering the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass composites. These laminates provide tight control over dielectric constant (Dk) and low loss while utilizing the same processing methods as standard epoxy/glass laminates. The greatest advantage ofRogers4003C is its cost-effectiveness compared to conventional microwave laminates, making it an ideal choice for high-frequency applications. Unlike PTFE-based microwave materials, no special through-hole treatments or handling procedures are required. Additionally, RO4003C materials are non-brominated for improved environmental safety.

2.1Features:

The RO4003C material boasts a range of impressive features, including:

RO4003C:

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz

- Thermal Conductivity of 0.71 W/m/°K

- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C

- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C

- Low Z-axis coefficient of thermal expansion at 46 ppm/°C

- Tg >280°C

- Low Moisture Absorption of 0.06%

2.2 FR-4 S1000-2M:

The FR-4 S1000-2M layer in the 6 layer board stackup complements the RO4003C material with the following features:

-Lower Z-Axis CTE for improved throughhole reliability

-Excellent Mechanical Processability andThermal Resistance

-Leadfree Compatible

-Tg180℃(DSC), UV Blocking/AOI compatible

-High heat resistance

-Excellent Anti-CAF performance

-Low water absorption

PCB Stackup and Construction details:

The hybrid circuit board stackup consists of six layers, meticulously designed to achieve optimal performance and reliability. The layer composition is as follows:

Construction details:

PCB Statistics

To encompass the comprehensive functionality of the multilayer printed circuit board hybrid PCB, it supports the connection and integration of various components and offers the following key statistics:

Artwork, Standards, and Availability

The PCB is designed using the Gerber RS-274-X format and complies with IPC-Class-2 standards, ensuring high manufacturing quality. This hybrid circuit materials PCB is globally available, making it accessible for customers worldwide.

Typical Applications

The Hybrid PCB of RO4003C and FR-4 is suitable for a wide range of applications, including but not limited to:

Commercial Airline Broadband Antennas

Microstrip and Stripline Circuits

Millimeter Wave Applications

Guidance Systems

Point to Point Digital Radio Antennas

Conclusion

In conclusion, the Hybrid PCB of RO4003C and FR-4 offers exceptional electrical performance, reliable manufacturing, and versatile applications. With its carefully selected materials, meticulous construction, and adherence to industry standards, it provides a robust solution for demanding electronic designs. Moreover, its availability worldwide ensures accessibility for customers in various regions. Whether it is for aerospace, telecommunications, or radar systems, this Hybrid PCB serves as a reliable and efficient solution for high-frequency.