Flexible
Printed Circuit (FPC) Flexible PCB On Polyimide With Black Solder Mask
(Flexible
printed circuits are custom-made products, the picture and parameters shown are
just for reference)
General
description
It’s a 4 layer FPC at 0.3mm thick. The base laminate is from Shengyi. It’s
fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener
is applied on the inserting part.
Parameter
and data sheet:
|
Size of
Flexible PCB
|
70.18 X 40.28mm
|
|
Number of Layers
|
4
|
|
Board Type
|
Flexible PCB
|
|
Board Thickness
|
0.30mm
|
|
Board Material
|
Polyimide
25µm
|
|
Board Material Supplier
|
ITEQ
|
|
Tg Value of Board Material
|
60℃
|
|
|
|
PTH Cu thickness
|
≥20 µm
|
|
Inner Iayer Cu thicknes
|
N/A
|
|
Surface Cu thickness
|
35
µm
|
|
|
|
|
Coverlay Colour
|
Black
|
|
Number of Coverlay
|
2
|
|
Thickness of Coverlay
|
25
µm
|
|
Stiffener Material
|
Polyimide
|
|
Stiffener Thickness
|
0.2mm
|
|
|
|
|
Type of Silkscreen Ink
|
IJR-4000
MW300
|
|
Supplier of Silkscreen
|
TAIYO
|
|
Color of Silkscreen
|
White
|
|
Number of Silkscreen
|
1
|
|
|
|
Peeling test of Coverlay
|
No
peelable
|
|
Legend Adhesion
|
3M 90℃No
peeling after Min. 3 times test
|
|
|
|
Surface Finish
|
Immersion
Gold
|
|
Thickness of Nickle/Gold
|
Au:
0.03µm(Min.); Ni 2-4µm
|
|
RoHS Required
|
Yes
|
|
Famability
|
94-V0
|
|
|
|
Thermal Shock Test
|
Pass, -25℃±125℃, 1000 cycles.
|
|
Thermal Stress
|
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
|
|
Function
|
100%
Pass electrical test
|
|
Workmanship
|
Compliance
with IPC-A-600H & IPC-6013C Class 2
|
Features
and benefits:
Excellent
flexibility
Reducing
the volume
Weight
reduction
Consistency
of assembly
Increased
reliability
The
end can be whole soldered
Low
cost
Continuity
of processing
Focus
on low to medium volume production
Make
delivery on time. We keep higher than 98% on-time-delivery rate.
Applications:
Keypad
FPC, FFC for industrial control equipment, consumer game consoles
Covercoat
/ Solder Mask:
Solder
mask in flexible PCB is different from rigid board, it is usually a polyimide
film coated on one side with a semi-cured and non-tacky adhesive, we call it
covercoat in flexible circuit. It is laminated to the flexible circuit under
heat and pressure, so that the copper pattern is fully encapsulated except for
the solder pads that are exposed through access holes in the covercoat.
The
covercoat production sheet should be cut slightly smaller than the flexible
circuit production sheet to avoid premature edge sealing, which could trap air
bubbles in the package.
The
production sheet for the covercoat is provided with tooling holes in close
register with the tooling holes in the production sheet for the flexible
circuit. The access holes are usually drilled, but in the case of high-volume
production, punching is more cost-effective.
In
principle, drilling of the covercoat is accomplished in the same way as when
drilling rigid boards, i.e., a number of covercoat sheets are stacked, either
5-up or 10-up. The drilling parameters, however, are somewhat different,
because of the polyimide material and the absence of copper foil, which
otherwise could have removed some of the heat from the holes being drilled.
When
drilling/punching large covercoat production sheets, it is necessary to
compensate for the dimensional changes of the flexible circuit production
sheet, which can amount to as much as 0.2%.
More
Displays of Black Flexible Circuits
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