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SCGA-500F GF265 is an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.
Item NO.:
BIC-203-v161.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
High Frequency PCB Built on Shengyi SCGA-500 GF265 PTFE with Glass Reinforced RF Circuit Materials
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
SCGA-500 GF265 from Shengyi Technology Co., Ltd (SYTECH) is low loss PTFE woven glass UL 94 V-0 high frequency circuit material. It has been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.
Its controlled dielectric constant provides excellent electrical and mechanical properties with a consistent and stable DK (2.55Dk +/- 0.04) and dissipation factor (0.0014) over a wide range of frequencies (1GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).
It exhibits exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).
Features
1.Consistent and Stable Dk/Df over Frequency and Temperature
2.Low Dielectric Loss Tangent
3.Excellent Price Performance Value
Typical applications
1.Base Station Antennas
2.Power Amplifiers
3.Satellite Communications
4.DAS and CPE Antenna
5.Automotive Radar and Wireless Communications.
PCB Capability
PCB Capability (SCGA-500 GF265) | |
PCB Material: | PTFE Woven Glass |
Designation: | SCGA-500 GF265 |
Dielectric constant: | 2.65 (10 GHz) |
Dissipation factor | 0.0017 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Our Advantages
1.ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
2.Powerful PCB capabilities support your research and development, sales and marketing;
3.Any Layer HDI PCBs;
4.16000㎡workshop; 30000㎡output capability per month; 8000 types of PCB's per month;
5.More than 19+ years of high frequency PCB experience;
6.No MOQ, low cost for prototypes and small runs quantity;
7.Prototype PCB capability to Volume Production capability;
8.Delivery on time: >98% ; Customer complaint rate: <1%
9.IPC Class 2 / IPC Class 3;
Appendix: General Properties of SCGA-500
SCGA-500 General Properties | |||||||
Items | Typical Value GF220 | Typical Value GF255 | Typical Value GF265 | Typical Value GF300 | Unit | Method | Test Condition |
Dielectric Constant | 2.2±0.02 | 2.55±0.04 | 2.65±0.04 | 3.00±0.04 | - | IPC-TM-650 2.5.5.5 | 10GHz/23℃ |
Process Dk | |||||||
Dissipation factor (Loss Tangent) | 0.0009 | 0.0014 | 0.0017 | 0.0023 | - | IPC-TM-650 2.5.5.5 | 10GHz/23℃ |
TcDK | -110 | -70 | -60 | -25 | ppm/℃ | IEC 61189-2-721 | 10GHz (-40-150℃) |
CTE (X/Y/Z-axis) | 41/30/217 | 8.2/7.9/145 | 9.2/8.8/118 | 6.2/8.6/95 | ppm/℃ | IPC-TM-650 2.4.24 | TMA (30-260℃) |
Volume Resistivity | 1.5*108 | 1.5*108 | 1.2*108 | 1.3*108 | MΩ·cm | IPC-TM-650 2.5.17.1 | A |
Surface Resistivity | 8.8*107 | 1.6*108 | 1.3*108 | 1.4*108 | MΩ | IPC-TM-650 2.5.17.1 | A |
Peel Strength | 1.2 [6.86] | 1.2 [6.86] | 1.2 [6.86] | 1.2 [6.86] | N/mm [lb/in] | IPC-TM-650 2.4.8 | 288℃/10s |
Water Absorption | 0.007 | 0.007 | 0.007 | 0.01 | % | IPC-TM-650 2.6.2.1 | D-24/23 |
Thermal Conductivity | 0.27 | 0.29 | 0.28 | 0.28 | W/(m·K) | ASTM C518 | 100℃ |
Tensile Modulus (LW/CW) | 1.9/2.6 | 1.27/7.8 | 1.9/6.8 | 7.9/8.8 | GPa | IPC-TM-650 2.4.4 | A |
Tensile Strength (LW/CW) | 60/76 | 64/214 | 60/212 | 254/279 | MPa | IPC-TM-650 2.4.4 | A |
Density | 2.18 | 2.25 | 2.22 | 2.27 | g/cm3 | ASTM D792 | - |
Flammability | V-0 | V-0 | V-0 | V-0 | Rating | UL-94 | C-48/23/50 |
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