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The TC600 high frequency PCB laminates sets a new standard in PCB substrates, delivering unparalleled heat dissipation, low losses, and exceptional mechanical properties.
Item NO.:
BIC-278-v344.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TC600 PCB 30mil 0.762mm Double Layer Circuit Printed Circuit Board
Introduction
Introducing the TC600 PCB, a high-performance printed circuit board substrate designed to revolutionize the world of electronics. Engineered with woven fiberglass reinforcement, ceramic fillers, and a PTFE-based composite, this cutting-edge PCB offers exceptional heat transfer capabilities, reduced dielectric and insertion losses, and improved mechanical robustness. With a dielectric constant of 6.15 and best-in-class thermal conductivity, theRogersTC600 provides unparalleled performance in a range of applications, making it the ultimate choice for designers and engineers seeking superior heat dissipation and management.
Key Features
2.1 Dielectric Constant:
The TC600RogersPCB material exhibits a dielectric constant (DK) of 6.15 at both 1.8MHz and 10GHz at 23°C. This exceptional DK allows for highly efficient signal transmission and low signal loss, ensuring optimal performance of amplifiers, antennas, and high-frequency circuits.
2.2 Dissipation Factor:
With a dissipation factor of 0.0017 at 1.8GHz and 0.0020 at 10GHz at 23°C, the TC600 PCB minimizes energy losses, resulting in higher amplifier and antenna gains, improved power efficiency, and enhanced overall system performance.
2.3 Temperature Coefficient of DK:
The TC600 PCB boasts a temperature coefficient of DK (TcDK) of -75 ppm/°C over a wide temperature range of -40°C to 150°C. This remarkable feature ensures consistent electrical performance across various operating conditions, making it an ideal choice for applications that require thermal stability and reliability.
2.4 Moisture Absorption:
With a moisture absorption rate of only 0.03%, the TC600 PCB maintains its electrical and mechanical properties even in humid environments, ensuring long-term reliability and performance stability.
2.5 Coefficient of Thermal Expansion (CTE):
The TC600 PCB exhibits a low coefficient of thermal expansion (CTE) in the X and Y axes, measuring 9 ppm/°C, while the Z-axis CTE is 35 ppm/°C. This balanced expansion minimizes stress on components and solder joints, reducing the risk of failure due to thermal cycling.
2.6 Thermal Conductivity:
The TC600 PCB offers outstanding thermal conductivity, with a z-axis thermal conductivity of 1.1 W/mK and x,y-axis thermal conductivity of 1.4 W/mK. This excellent heat transfer capability ensures efficient thermal management, reduces hot-spots, and improves device reliability, making it an excellent choice for high-power applications.
Benefits
3.1 Heat Dissipation and Management:
The TC600 30mil Rogers substrate PCB is designed to effectively dissipate heat generated by high-power components, reducing the risk of overheating, hot-spots, and premature system failure. Its outstanding thermal conductivity allows designers to manage heat effectively, extending the lifespan of active components and improving overall system reliability.
3.2 Very Low Loss Tangent:
The extremely low loss tangent of the TC600 PCB translates to higher amplifier and antenna efficiencies, ensuring maximum signal integrity and optimal system performance. This feature is especially crucial for applications requiring high-quality signal transmission, such as wireless communication systems and radar equipment.
3.3 Mechanical Robustness:
Unlike brittle laminates that cannot withstand processing, impacts, or high g-forces, the TC600 PCB offers exceptional mechanical robustness. Its woven fiberglass reinforcement provides durability, ensuring reliable performance even in demanding environments.
3.4 Affordable Pricing for Commercial Applications:
The TC600 PCB is competitively priced, making it a cost-effective solution for commercial applications. It offers superior performance without compromising on quality, making it an excellent choice for a wide range of industries.
3.5 High Peel Strength:
The TC600 PCB demonstrates high peel strength, ensuring reliable adhesion of narrow lines and contributing to overall robustness. This feature is particularly important in applications that involve high mechanical stress, such as automotive electronics and aerospace systems.
3.6 Improved Processing and Reliability:
Designed to meet the highest standards of quality and reliability, the TC600 PCB simplifies the manufacturing process while delivering excellent consistency and performance. Its enhanced mechanical and electrical properties contribute to reduced defects, improved yields, and overall manufacturing efficiency.
PCB Stackup and Construction Details
The TC600 PCB is a double layer circuit PCB constructed as follows:
Copper Layer 1: 35μm
TC600 Laminate: 0.762 mm (30mil)
Copper Layer 2: 35μm
Additional construction details include:
Construction Details |
Specifications |
Board dimensions |
61.99mm x 39.99mm (+/- 0.15mm) |
Minimum Trace/Space |
5/5 mils |
Minimum Hole Size |
0.3mm |
Blind vias |
No |
Finished board thickness |
0.8mm |
Finished Cu weight |
1oz (1.4 mils) |
Via plating thickness |
20 μm |
Surface finish |
Immesion Gold |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical test |
100% |
PCB Statistics
The TC600 Rogers RF PCB 30mil is designed to accommodate a variety of applications and boasts the following statistics:
Description |
Value |
Components |
5 |
Total Pads |
23 |
Thru Hole Pads |
15 |
Top SMT Pads |
7 |
Bottom SMT Pads |
0 |
Vias |
21 |
Nets |
1 |
Artwork and Standards
The TC600 PCB supports Gerber RS-274-X artwork and adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and reliability.
Availability
The TC600 PCB is available worldwide, providing engineers and designers across the globe with access to this advanced and game-changing PCB substrate.
Typical Applications
The TC600 PCB is suitable for various applications, including but not limited to:
Power Amplifiers, Filters, and Couplers
Microwave Combiner and Power Divider Boards in Avionics Applications
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
GPS & Hand-held RFID Reader Antennas
Conclusion
The TC600 high frequency PCB laminates sets a new standard in PCB substrates, delivering unparalleled heat dissipation, low losses, and exceptional mechanical properties. With its high thermal conductivity, reduced dielectric loss, and robust construction, it is the ideal choice for demanding applications that require efficient heat management, reliability, and superior performance. Trust the TC600 Rogers PCB to elevate your designs and unlock new possibilities in the world electronics.
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