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Home Newly Shipped RF PCB Rogers TMM3 PCB 25mil 0.635 mm 2-layer TMM Series High Frequency Circuit Board

Rogers TMM3 PCB 25mil 0.635 mm 2-layer TMM Series High Frequency Circuit Board


TMM3 25mil Rogers PCB offers outstanding performance, reliability, and versatility for a wide range of high-frequency and microwave applications. 










  • Item NO.:

    BIC-279-v345.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers TMM3 PCB 25mil 0.635 mm 2-layer TMM Series High Frequency Circuit Board

 

Introduction

When it comes to demanding microwave applications, reliability and performance are crucial factors. That's where TMM3 PCB 25mil comes into play. Developed by Rogers Corporation, a leading provider of high-performance materials,TMM3 PCB offers a unique blend of properties that make it an exceptional choice for strip-line and micro-strip applications requiring plated thru-hole reliability. Combining the advantages of ceramic and traditional PTFE microwave circuit laminates, TMM3 PCB delivers outstanding performance without the need for specialized production techniques.

 

Key Features

TMM3 25mil High Frequency PCB boasts an impressive array of features that contribute to its exceptional performance:

 

2.1 Dielectric Constant (Dk):

 With a Dk value of 3.27±.032 at 10GHz, TMM3 PCB offers excellent electrical properties, ensuring accurate signal transmission without compromising signal integrity.

 

2.2 Dissipation Factor:

TMM3 PCB demonstrates a low dissipation factor of .0020 at 10GHz. This feature allows for minimal signal loss, resulting in better performance and higher efficiency in microwave applications.

 

2.3 Thermal Coefficient of Dk:

The thermal coefficient of Dk of 37 ppm/°K ensures the stability of the board's dielectric properties over a wide temperature range, making TMM3 PCB highly suitable for applications with varying thermal conditions.

 

2.4 Coefficient of Thermal Expansion:

TMM3 PCB is designed with a coefficient of thermal expansion matched to copper, minimizing the risk of delamination and ensuring reliable performance under thermal stress.

 

2.5 High Decomposition Temperature:

With a TGA decomposition temperature (Td) of 425°C, TMM3 PCB exhibits exceptional thermal durability, making it suitable for applications involving high-temperature environments.

 

2.6 Thermal Conductivity:

TMM3 PCB possesses a thermal conductivity of 0.7W/mK, allowing for efficient heat dissipation and preventing hotspots in high-power applications.

 

2.7 Versatile Thickness Options:

Available in a thickness range of .0015 to .500 inches, with a tolerance of +/- .0015 inches, TMM3 PCB provides flexibility to suit various design requirements, ensuring optimal performance and space utilization.


Rogers TMM3 

 

Benefits

The RogersTMM3 PCB 25mil offers various benefits that set it apart from other materials:

 

3.1 Mechanical Stability:

TMM3 PCB exhibits exceptional resistance to creep and cold flow, ensuring long-term reliability and stability in demanding environments.

 

3.2 Chemical Resistance:

TMM3 PCB is highly resistant to process chemicals, reducing the risk of damage during fabrication and increasing the lifespan of the board.

 

3.3 Simplified Production Process:

Unlike other materials, TMM3 PCB does not require a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process and reducing production time and costs.

 

3.4 Reliable Wire-Bonding:

Based on a thermoset resin, TMM3 PCB ensures reliable wire-bonding without pad lifting or substrate deformation, making it an ideal choice for applications that require precision connections.

 

 

PCB Construction Details

TMM3 PCB features a 2 layer PCB stackup configuration, consisting of the following components:

 

Copper Layer 1: 35μm

Rogers TMM3 Core: 0.635 mm (25mil)

Copper Layer 2: 35μm

 

Additionally, the construction details of TMM3 PCB include precise measurements and specifications:

 

Construction Details

Specifications

Board dimensions

42.91mm x 108.31mm

Minimum Trace/Space

5/9 mils

Minimum Hole Size

0.3mm

Blind vias

No

Finished board thickness

0.7mm

Finished Cu weight

1oz (1.4 mils)

Via plating thickness

20 μm

Surface finish

Immersion Silver

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical test prior to shipment

100%

 

 

PCB Statistics

PCB Statistics

Value

Components

17

Total Pads

44

Thru Hole Pads

26

Top SMT Pads

18

Bottom SMT Pads

0

Vias

23

Nets

3

 

 

Quality Standard and Availability

TMM3 PCB 25mil Rogers substrate adheres to the IPC-Class-2 quality standard, ensuring the highest level of reliability and consistency. This standard guarantees compliance with strict criteria for design, production, and performance.

 

Moreover, TMM3 Rogers board PCB is available worldwide, making it easily accessible for customers across different regions and industries.

 

Typical Applications

TMM3 high frequency PCB demonstrates its versatility in a wide range of applications:

 

RF and Microwave Circuitry

Power Amplifiers and Combiners

Filters and Couplers

Satellite Communication Systems

Global Positioning Systems (GPS) Antennas

Patch Antennas

Dielectric Polarizers and Lenses

Chip Testers

 

Conclusion

In conclusion, TMM325mil Rogers PCB offers outstanding performance, reliability, and versatility for a wide range of high-frequency and microwave applications. With its unique blend of ceramic and PTFE properties, combined with the benefits of thermoset resin, TMM3 high frequency laminate PCB provides excellent signal integrity, thermal stability, and ease of manufacturing. Trust in TMM3 PCB for your next project and experience the exceptional performance it brings to your.




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