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Home PCB Prototype Rogers HF PCB Built on RT/Duroid 6002 30mil DK2.94 Immersion Goldequency PCB

Rogers HF PCB Built on RT/Duroid 6002 30mil DK2.94 Immersion Goldequency PCB

Rogers RO3006 was designed to offer exceptional electrical and mechanical stability at competitive prices.


  • Item NO.:

    BIC-053-v53.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



Rogers HF PCB Built on RT/Duroid 6002 30mil 0.762mm DK2.94 With Immersion Gold for Global Positioning System Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)



Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.


The thermal coefficient of dielectric constant is extremely low from -55℃to +150℃which provides the designers of filters, oscillators and delay lines the electrical stability needed in today's demanding applications.


A low Z axis coefficient of thermal expansion(CTE) ensures excellent reliability of plated through holes. RT/duroid 6002 materials have been successfully temperature cycled (-55℃TO 125℃) for over 5000 cycles without a single via failure.

 

Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances.


The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal (6 ppm/℃) further increasing surface mount reliability.


RO6002 PCB 30mil


Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such antennas, complex mutli-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments.


Typical applications:


1. Airborne radar systems

2. Beam forming networks

3. Commercial airline collision avoidance

4. Global positioning systems antennas

5. Ground base systems

6. High reliability complex multi-layer circuits

7. Phased array antennas

8. Power backplanes


PCB Specifications:


PCB SIZE 60 x 35 mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RT/duroid 6002 0.762mm
copper ------- 18um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.3mm / 1.0mm
Number of Different Holes: no
Number of Drill Holes: no
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RT/duroid 6002 0.762mm
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  0.8 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold (61.4% ) 0.05µm over 3µm nickel
Solder Mask Apply To:  Top and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Rogers 6002 (RT/duroid 6002):


RT/duroid 6002 Typical Value
Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 2.94 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/℃ 10 GHz 0℃-100℃ IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23℃ ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi) ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 ASTM D 792
Specific Heat 0.93(0.22) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel 8.9(1.6) Ibs/in.(N/mm) IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION



BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

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