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Home Newly Shipped RF PCB 2-layers Rogers Arlon 60mil AD250C Material PCB High Frequency Board

2-layers Rogers Arlon 60mil AD250C Material PCB High Frequency Board


AD250C PCBs are becoming increasingly popular in industries that require high-frequency performance, low signal loss, and superior thermal stability. This article aims to provide a comprehensive overview of the electrical and thermal properties of this cutting-edge PCB material.






  • Item NO.:

    BIC-N10-v216.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



2-layers Rogers Arlon 60mil AD250C Material PCB High Frequency Board

 

This 60mil AD250C woven glass reinforced PTFE material used in the PCB is a high-performance dielectric material known for its excellent thermal stability, low loss tangent, and high breakdown voltage. This makes it ideal for use in applications that require high-frequency performance and low signal loss.

 

The lead-free process used in the manufacture of the Arlon AD250C PCB ensures that it is environmentally friendly and complies with RoHS (Restriction of Hazardous Substances) regulations.

 

Arlon AD250C PCB



The 60mil AD250C PCB has a 2-layer stackup design with copper layers on both sides of the AD250C 60mil dielectric(1.524mm). The finished copper weight is 70um, and the finished board thickness is 1.6mm.

 

Construction details:

Construction Details

Specifications

Board Dimensions

171mm x 76mm

Board Dimensions Tolerance

+/- 0.15mm

Minimum Trace/Space

4/4 mils

Minimum Hole Size

0.35mm

Blind/Buried Vias

No

Finished Board Thickness

1.6mm

Finished Cu Weight

2 oz (2.8 mils) all layers

Via Plating Thickness

1 mil

Surface Finish

Immersion Gold

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Silkscreen on Solder Pads

No

Electrical Test

100%

 

PCB Statistics:

PCB Statistics

Quantity

Components

167

Total Pads

211

Thru Hole Pads

122

Top SMT Pads

89

Bottom SMT Pads

0

Vias

97

Nets

6

 

 Rogers AD250C PCB

 

Applications of AD250C PCBs

Rogers AD250C PCBs are suitable for a wide range of applications, including industrial control systems, medical devices, and consumer electronics. They are also environmentally friendly and compliant with RoHS regulations.

 

Conclusion:

AD250C woven glass reinforced PTFE PCBs offer a range of advantages over other PCB materials, including superior electrical and thermal properties, low signal loss, and high breakdown voltage.

They are also environmentally friendly and compliant with RoHS regulations. With their small form factor, excellent electrical conductivity, and clean and professional look, they are ideal for a wide range of applications in industries such as industrial control systems, medical devices, and consumer electronics. We provide our artwork in Gerber RS-274-X format and adhere to the IPC-Class-2 standard.

 

AD250C PCB Data sheet:

Electrical Properties

AD250C

Units

Test Conditions

Test Method

 

PIM (30mil/60mil)

-159/-163

dBc

Reflected 43 dBm swept tones at 1900 MHz, S1/S1

Rogers Internal 50 ohm

 

Dielectric Constant (process)

2.52

-

23°C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)

 

Dielectric Constant (design)

2.50

-

C-24/23/50

10 GHz

Microstrip Differential Phase Length

 

Dissipation Factor (process)

0.0013

-

23°C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5

 

Thermal Coefficient of Dielectric Constant

-117

ppm/ºC

0°C to 100°C

10 GHz

IPC TM-650 2.5.5.5

 

Volume Resistivity

4.8 x 108

Mohm-cm

C-96/35/90

-

IPC TM-650 2.5.17.1

 

Surface Resistivity

4.1 x 107

Mohm

C-96/35/90

-

IPC TM-650 2.5.17.1

 

Electrical Strength (dielectric strength)

979

V/mil

-

-

IPC TM-650 2.5.6.2

 

Dielectric Breakdown

>40

kV

D-48/50

X/Y direction

IPC TM-650 2.5.6

 

Thermal Properties

 

Decomposition Temperature (Td)

>500

˚C

2hrs @ 105˚C

5% Weight Loss

IPC TM-650 2.3.40

 

Coefficient of Thermal Expansion - x

47

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

 

Coefficient of Thermal Expansion - y

29

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

 

Coefficient of Thermal Expansion - z

196

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

 

Thermal Conductivity

0.33

W/mK

-

z direction

ASTM D5470

 

Time to Delamination

>60

minutes

as-received

288˚C

IPC TM-650 2.4.24.1

 

Mechanical Properties

 

Copper Peel Strength after Thermal Stress

2.6
(14.8)

N/mm (lbs/in)

10s @288˚C

35 μm foil

IPC TM-650 2.4.8

 

Flexural Strength (MD/CMD)

8.8/6.4 (60.7/44.1)

MPa (ksi )

25°C ± 3°C

-

ASTM D790

 

Tensile Strength (MD/CMD)

6.0/5.6 (41.4/38.6)

MPa (ksi )

23°C/50% RH

-

ASTM D3039/D3039-14

 

Flex Modulus (MD/CMD)

885/778 (6,102/5,364)

MPa (ksi )

25°C ± 3°C

-

IPC-TM-650 Test Method 2.4.4

 

Dimensional Stability (MD/CMD)

0.02/0.06

mils/inch

after etch + bake

-

IPC-TM-650 2.4.39a

 

Physical Properties

 

Flammability

V-0

-

-

-

UL-94

 

Moisture Absorption

0.04

%

E1/105 +D48/50

-

IPC TM-650 2.6.2.1

 

Density

2.28

g/cm3

C-24/23/50

-

ASTM D792

 

Specific Heat Capacity

0.813

J/g°K

2 hours at 105°C

-

ASTM E2716

 

 






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