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Home Newly Shipped RF PCB F4BM265 Wangling PCB 3.0mm Laminate 2-layer F4BM High Frequency Circuit Board HASL Lead Free

F4BM265 Wangling PCB 3.0mm Laminate 2-layer F4BM High Frequency Circuit Board HASL Lead Free


F4BM265 exhibits superior electrical performance, including lower dielectric loss, increased insulation resistance, and improved stability. Offering comparable performance to similar foreign products.









  • Item NO.:

    BIC-250-v315.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



F4BM265 Wangling PCB 3.0mm Laminate 2-layer F4BM High Frequency Circuit Board HASL Lead Free

 

Introduction

Wangling's F4BM265 laminates represent a significant advancement in PCB technology. These laminates are meticulously crafted using a scientific formulation that combines fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and polytetrafluoroethylene film. Compared to its predecessor, F4B265, F4BM265 exhibits superior electrical performance, including lower dielectric loss, increased insulation resistance, and improved stability. Offering comparable performance to similar foreign products, F4BM265 is a versatile choice for a wide range of applications.

 

Dielectric Layer and Copper Foil Options

F4BM265 and F4BME265 share the same dielectric layer but differ in their copper foil combinations. F4BM265 employs ED copper foil, making it ideal for applications that do not require passive intermodulation (PIM) performance. On the other hand, F4BME265 is paired with reverse-treated foil (RTF) copper foil, delivering excellent PIM performance, precise line control, and lower conductor loss.

 

Controlled Dielectric Constant and Dimensional Stability

The ratio between polytetrafluoroethylene and fiberglass cloth in F4BM265 and F4BME265 allows for precise control of the dielectric constant. This precise control results in low loss and enhanced dimensional stability. A higher proportion of fiberglass corresponds to a higher dielectric constant, which contributes to better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.

 

 

Key Features of F4BM265

 

1)Dielectric Constant (Dk) of 2.65 at 10GHz:

F4BM265 exhibits a stable dielectric constant, ensuring reliable signal transmission and maintaining signal integrity in high-frequency applications.

 

2)Dissipation Factor of 0.0013 at 10GHz:

With an exceptionally low dissipation factor, F4BM265 minimizes signal loss and guarantees high-performance signal transmission.

 

3)Coefficient of Thermal Expansion (CTE)

x-axis: 14 ppm/°C

y-axis: 17 ppm/°C

z-axis: 142 ppm/°C

F4BM265 offers controlled CTE values along different axes, enabling thermal stability and reducing the risk of failure due to temperature variations.

 

4)Low Thermal Coefficient of Dk:

F4BM265 exhibits a low thermal coefficient of Dk, ensuring minimal signal distortion over a wide temperature range (-55°C to 150°C).

 

5)Moisture Absorption of ≤0.08%:

The low moisture absorption rate of F4BM265 enhances its reliability and performance in humid environments.

 

6)Flammability: UL-94 V0:

F4BM265 complies with UL-94 V0 flammability standards, providing excellent fire resistance and safety.

 

F4BM265 substrate PCB

 

F4BM265 PCB Stackup

2-layer rigid PCB

Copper_layer_1 - 70 μm

F4BM265 Core - 3.00 mm (118mil)

Copper_layer_2 - 70 μm

 

PCB Construction and Specifications

The F4BM265 substrate PCB is a 2 layer circuit board with a detailed construction designed to meet demanding performance requirements. Here are the key specifications:

 

PCB Construction Details

Specifications

Board Dimensions

45.33mm x 50.2mm (1PCS), +/- 0.15mm

Minimum Trace/Space

5/5 mils

Minimum Hole Size

0.5mm

Blind Vias

No

Finished Board Thickness

3.1mm

Finished Cu Weight

1oz (1.4 mils) on outer layers

Via Plating Thickness

20 μm

Surface Finish

HASL Lead Free

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Black

Bottom Solder Mask

No

Electrical Test

100% Electrical test prior to shipment

 

 

Statistical details


PCB Statistics

Quantity

Components

12

Total Pads

37

Thru Hole Pads

21

Top SMT Pads

16

Bottom SMT Pads

0

Vias

25

Nets

2

  

The quality standard adhered to during the manufacturing process is IPC-Class-2. This standard ensures consistent and reliable PCB manufacturing, meeting the stringent requirements of various industries.

 

Availability and Artwork

The F4BM265 PCB is readily available worldwide, making it easily accessible for customers across different regions. The PCB design files are supplied in Gerber RS-274-X format, a widely accepted industry standard for PCB manufacturing. This ensures compatibility and ease of use for PCB manufacturers and assembly houses.

 

Typical Applications

The F4BM265 PCB is specifically engineered for high-performance applications that demand exceptional electrical properties and dimensional stability. Here are some typical applications where F4BM265 excels:

 

1)Microwave, RF, and Radar Systems:

F4BM265 is well-suited for applications in these systems, providing reliable signal transmission and maintaining signal integrity at high frequencies.

 

2)Phase Shifters:

The precise control of dielectric constant in F4BM265 makes it an ideal choice for phase shifter applications, ensuring accurate phase control.

 

3)Power Dividers, Couplers, and Combiners:

F4BM265 offers low loss, excellent dimensional stability, and controlled dielectric constant, making it suitable for power distribution and combination applications.

 

4)Feed Networks:

F4BM265 provides reliable signal distribution in feed network applications, ensuring efficient communication and minimal signal loss.

 

5)Phase-Sensitive Antennas and Phased Array Antennas:

F4BM265's stability and low loss characteristics make it suitable for phase-sensitive antennas and phased array antennas, enabling precise beamforming and signal control.

 

6)Satellite Communications:

F4BM265 can withstand the demanding environmental conditions of satellite communication systems, maintaining reliable performance in space applications.

 

7)Base Station Antennas:

F4BM265's high-performance characteristics contribute to the efficient operation of base station antennas, ensuring reliable and consistent signal transmission.

 

 

Conclusion

The F4BM265 high frequency PCB sets new standards in high-performance laminates, offering exceptional electrical properties, dimensional stability, and reliable signal transmission. With its controlled dielectric constant, low loss, and compatibility with various applications,F4BM265 3.0mm PCB is a versatile choice for demanding industries. Whether it's microwave systems, antennas, or power distribution applications, F4BM265 delivers reliable and high-quality performance. With worldwide availability and adherence to industry standards, the F4BM265 PCB is a reliable solution for advanced electronic designs.

 






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