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Home Newly Shipped RF PCB F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards

F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards


F4BTME298 high frequency PCB stands as a testament to the relentless pursuit of excellence in the field of connectivity solutions.














  • Item NO.:

    BIC-262-v328.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards

 

The F4BTME298 PCB, a pinnacle in modern PCB technology, is a product of unparalleled precision and innovation. Designed to meet the exacting demands of high-frequency applications, this PCB offers a host of features and capabilities that set it apart in the realm of connectivity solutions.

 

1. Introduction to F4BTME Series

The F4BTME series laminates represents a fusion of cutting-edge materials and advanced manufacturing techniques. By combining glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin, these laminates deliver a superior performance that surpasses conventional PCB substrates.

 

At the core of the F4BTME series lies the F4BM dielectric layer, which is enriched with high dielectric constant nano-ceramics. This integration imbues the laminates with enhanced dielectric properties, exceptional heat resistance, reduced thermal expansion, improved insulation, and superior thermal conductivity—all while maintaining minimal signal loss characteristics.

 

Moreover, the 60mil F4BTME laminates are meticulously paired with reverse-treated RTF copper foil, ensuring outstanding performance in terms of PIM (Passive Intermodulation), precise line control, and minimized conductor loss.


F4BTME298 PCB

 

2. Features of F4BTME298 PCB

Dielectric Constant: 2.98 +/- 0.06 at 10GHz

Dissipation Factor: 0.0018 at 10GHz, 0.0023 at 20GHz

Coefficient of Thermal Expansion (CTE):

x-axis: 15 ppm/°C

y-axis: 16 ppm/°C

z-axis: 78 ppm/°C

Temperature Range: -55°C to 288°C

Low Thermal Coefficient of Dk: -78 ppm/°C, -55°C to 150°C

PIM Value: <-160 dbc

Moisture Absorption: 0.05%

 

3. PCB Stackup and Construction Details

Stackup:2 layer circuit board

Copper Layer 1: 35μm

F4BTME298 Core: 1.524 mm (60mil)

Copper Layer 2: 35μm

 

Parameter

Value

Board Dimensions

51.51mm x 111.92 mm = 1PCS, +/- 0.15mm

Minimum Trace/Space

6/5 mils

Minimum Hole Size

0.3mm

Blind Vias

No

Finished Board Thickness

1.6mm

Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Electrical Test

100% prior to shipment

 

 

4. PCB Statistics

Statistics

Value

Components

29

Total Pads

75

Thru Hole Pads

52

Top SMT Pads

23

Bottom SMT Pads

0

Vias

41

Nets

3

 

 

5. Additional Information

Type of Artwork Supplied: Gerber RS-274-X

Quality Standard: IPC-Class-2

Availability: Worldwide

 

6. Typical Applications

The versatility and reliability of the F4BTME298 wholesale high frequency PCB make it an ideal choice for a wide range of applications, including:

 

Aerospace equipment, space, and cabin equipment

Microwave and RF devices

Radar systems, especially military radar

Feed networks

Phase-sensitive antennas and phased array antennas

Satellite communications, and more.

 

 

In conclusion, the F4BTME298 high frequency PCB stands as a testament to the relentless pursuit of excellence in the field of connectivity solutions. With its unmatched performance characteristics and broad applicability, this PCB is poised to drive innovation and empower the next generation of high-performance electronic devices.



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