F4BTME300 PCB 3.0mm Thick F4B DK3.5 Printed Circuit Board

F4BTME300 PCB 3.0mm Thick F4B DK3.5 Printed Circuit Board

Introduction:

The F4BTME300 PCB is part of the F4BTME series laminates, which are engineered with meticulous precision using a combination of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. These laminates feature a high-performance dielectric layer (F4BM) integrated with advanced nano-ceramics, resulting in remarkable electrical and mechanical properties. The F4BTME300 PCB offers exceptional dielectric constant, low loss, improved heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and enhanced thermal conductivity, making it an ideal choice for a wide range of applications.

Features:

The F4B DK3.5 PCB boasts several notable features that contribute to its superior performance and reliability:

Dielectric Constant (Dk):

The PCB exhibits a dielectric constant of 3.5 at 10GHz, ensuring excellent signal integrity and transmission efficiency.

Dissipation Factor:

With a dissipation factor of 0.0018 at 10GHz and 0.0023 at 20GHz, the F4BTME300 PCB minimizes signal loss and distortion, enabling high-frequency applications to operate with utmost precision.

Coefficient of Thermal Expansion (CTE):

The PCB demonstrates a low CTE of 15 ppm/°C (x-axis), 16 ppm/°C (y-axis), and 78 ppm/°C (z-axis) in the temperature range of -55°C to 288°C. This exceptional thermal stability ensures consistent performance under varying environmental conditions.

Thermal Coefficient of Dk:

The F4BTME300 PCB exhibits a low thermal coefficient of Dk at -75 ppm/°C in the temperature range of -55°C to 150°C, enabling reliable operation even in demanding thermal environments.

Passive Intermodulation (PIM) Performance:

With a PIM value of less than -160 dbc, the PCB ensures minimal interference and distortion, crucial for high-quality signal transmission in sensitive applications.

Moisture Absorption:

The F4BTME300 PCB has a moisture absorption rate of only 0.05%, ensuring long-term reliability and stability in humid environments.

PCB Stackup and Construction Details:

The F4BTME300 PCB features a 2-layer rigid construction, combining robustness with ease of manufacturing. The stackup consists of the following layers:

Copper Layer 1: 35 μm thickness

F4BTME300 Core: 3.0 mm (118 mil) thickness

Copper Layer 2: 35 μm thickness

PCB Statistics:

The F4BTME300 PCB is designed to accommodate a variety of applications, with the following statistics:

Artwork and Quality Standard:

The F4BTME300 PCB is manufactured using Gerber RS-274-X artwork, ensuring compatibility and ease of integration with standard design tools and workflows. It adheres to the IPC-Class-2 quality standard, guaranteeing consistent high-quality production and reliability.

Availability and Typical Applications:

The F4BTME300 PCB is available worldwide, making it easily accessible for various industries and applications. Its exceptional performance and reliability make it suitable for a wide range of uses, including:

1.Aerospace Equipment:

The PCB's robust construction and high-frequency capabilities make it ideal for aerospace applications, including space and cabin equipment.

2.Microwave and RF:

With its low loss and high dielectric constant, the F4BTME300 PCB enables efficient microwave and RF signal transmission, meeting the demanding requirements of these applications.

3.Radar Systems:

The F4BTME300 PCB is well-suited for radar systems, particularly military radar applications, where reliable and precise signal transmission is critical.

4.Feed Networks:

The PCB's exceptional dielectric properties and low loss characteristics make it an excellent choice for feed networks in various communication systems.

5.Phase-Sensitive Antennas and Phased Array Antennas:

The F4BTME300 PCB's high performance and thermal stability enable accurate phase-sensitive antenna systems and phased array antennas, ensuring optimal signal reception and transmission.

6.Satellite Communications:

With its superior dielectric properties, low loss, and reliable thermal performance, the F4BTME300 PCB is an ideal choice for satellite communication systems, where signal integrity and long-term reliability are paramount.

The versatility and high performance of the F4BTME300 PCB make it suitable for a wide range of applications in industries such as telecommunications, aerospace, defense, and microwave technology.

Conclusion

In conclusion, the F4BTME PCB combines advanced materials and precise manufacturing techniques to deliver exceptional performance, reliability, and thermal stability. With its low loss characteristics, high dielectric constant, and excellent thermal properties, it is an ideal choice for demanding applications in industries such as aerospace, microwave, radar, and satellite communications. The F4BTME300 PCB's ability to maintain signal integrity, minimize interference, and withstand harsh environmental conditions ensures reliable and efficient operation. Available worldwide and adhering to IPC-Class-2 quality standards, the F4BTME300 PCB sets a new standard for high-performance printed circuit boards.