Hybrid PCB on 20mil RO4003C and 4mil RO4350B Multilayer Rogers Substrate Board

Hybrid PCB on 20mil RO4003C and 4mil RO4350B Multilayer Rogers Substrate Board

Introduction to Hybrid PCBs:

Hybrid PCBs, also known as mixed construction PCBs, are a revolutionary approach to printed circuit board design. They combine different substrate materials, such as the industry-standard FR-4 and specialized materials like ceramic, flex, or metal core laminates, within a single board. This unique integration allows us to capitalize on the individual strengths of each material, resulting in a PCB that can outperform traditional homogeneous designs.

The key advantage of aHybrid PCB lies in its ability to address the specific requirements of diverse applications. By carefully selecting the appropriate materials for each layer, we can optimize the board's performance in areas like high-frequency signal transmission, thermal management, mechanical durability, and more. This tailored approach ensures that our customers can achieve the desired functionality and reliability in their end products.

Features of the RO4003C and RO4350B Materials

At the heart of our Hybrid PCB lies the exceptional 20mil RO4003C materials and 4mil RO4350B materials from Rogers Corporation. These advanced laminates have been specifically engineered to excel in high-frequency and high-performance applications.

RO4003C:

1)Dielectric Constant (Dk) of 3.38 ± 0.05, providing excellent signal integrity and low insertion loss.

2)Dissipation Factor (Df) of 0.0027 at 10GHz, ensuring low energy absorption and minimal signal distortion.

3)Thermal Coefficient of Dk of 40 ppm/°K, maintaining stable electrical properties across a wide temperature range.

4)Coefficient of Thermal Expansion (CTE) closely matched to copper, minimizing thermal-induced stress and deformation.

5)Decomposition Temperature (Td) of 425°C, offering exceptional thermal stability and reliability.

6)Thermal Conductivity of 0.71 W/mK, enabling efficient heat dissipation for high-power applications.

RO4350B:

1)Dielectric Constant (Dk) of 3.48 ± 0.05, delivering exceptional high-frequency performance.

2)Dissipation Factor (Df) of 0.0037 at 10GHz, ensuring low signal loss and superior signal integrity.

3)Thermal Coefficient of Dk of 50 ppm/°K, maintaining stable electrical characteristics across temperature variations.

4)Coefficient of Thermal Expansion (CTE) closely matched to copper, mitigating thermal-induced issues.

5)Decomposition Temperature (Td) of 390°C, providing robust thermal stability.

Thermal Conductivity of 0.69 W/mK, enabling efficient heat dissipation for high-power applications.

Hybrid PCB Stackup and Construction Details

Our 6-layer Hybrid PCB features a rigid design that seamlessly integrates the RO4003C and RO4350B materials. The stackup is carefully engineered to optimize performance and reliability:

Copper layer 1: 35 μm

RogersRO4350B Core: 0.102 mm (4 mil)

Copper layer 2: 35 μm

Prepreg - RO4450F: 4 mil

Copper layer 3: 35 μm

RogersRO4003C Core: 0.508 mm (20 mil)

Copper layer 4: 35 μm

Prepreg - RO4450F: 4 mil

Copper layer 5: 35 μm

RogersRO4003C Core: 0.508 mm (20 mil)

Copper layer 6: 35 μm

Construction Details:

PCB Statistics

Applications

Some of the typical applications for this Hybrid PCB include:

1.Cellular Base Station Antennas and Power Amplifiers:

The Hybrid PCB's exceptional high-frequency performance and thermal management capabilities make it an excellent choice for cellular base station equipment, including antennas and power amplifiers.

2.RF Identification Tags:

The versatility and reliability of this Hybrid PCB make it well-suited for RFID applications, where robust and compact design is paramount.

3.Automotive Radar and Sensors:

The Hybrid PCB's ability to withstand harsh environmental conditions and deliver precise signal transmission makes it a compelling option for automotive radar and sensor systems.

4.LNBs for Direct Broadcast Satellites:

The Hybrid PCB's high-frequency characteristics and thermal stability are essential for low-noise block (LNB) converters used in direct broadcast satellite systems.

Quality and Availability

Hybrid PCB is manufactured to the highest industry standards, meeting the requirements of IPC-Class-2. This certification ensures consistent quality, reliability, and performance, giving our customers the peace of mind they deserve.

The Hybrid RF Circuit Boards is available worldwide, allowing us to serve a diverse customer base across various industries and regions. Our global supply chain and distribution network guarantee prompt delivery and accessibility to meet our customers' needs.

Conclusion

In conclusion, our newly shipped Hybrid PCB is a testament to our commitment to technological innovation and customer-centric solutions. By seamlessly integrating the exceptional properties of 20mil RO4003C substrates and 4mil RO4350B substrates, we have created a versatile and high-performance printed circuit board that can unlock new possibilities for a wide range of applications.

With its unparalleled signal integrity, thermal management capabilities, and robust construction, this Hybrid printed circuit board is poised to revolutionize the way our customers approach their high-frequency and high-performance design challenges. We are excited to partner with you and help you unlock the full potential of this cutting-edge technology.

Please let me know if you have any further questions or if there is anything else I can assist you with. I'm here to provide you with the support and expertise you need to make the most of this remarkable Hybrid PCB.