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An SMT (Surface Mount Technology) stencil, also known as a solder paste stencil or solder mask stencil, is a vital component in the manufacturing of printed circuit boards (PCBs).
Item NO.:
BIC-239-v304.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Laser Cut SMT Stencil 0.12mm Foil PCB Stencil Framework
Introduction to SMT Stencils
An SMT (Surface Mount Technology) stencil, also known as a solder paste stencil or solder mask stencil, is a vital component in the manufacturing of printed circuit boards (PCBs). This thin, precisely engineered sheet plays a pivotal role in the accurate application of solder paste onto the PCB's pads before the surface mount components are placed. By providing a controlled and consistent solder paste deposition, the SMT stencil helps to ensure the proper electrical connections and mechanical integrity of the assembled circuit board.
Features of Our Laser Cut SMT Stencil 0.12mm Foil:
The PCB Stencil Framework are renowned for their exceptional quality and precision. Manufactured from high-grade stainless steel foil with a thickness ranging from 0.05mm to 0.4mm, our stencils are available in sizes from 300mm x 300mm to 736mm x 736mm, catering to a wide range of PCB dimensions. The stencils are fabricated in accordance with the IPC 7525A industry standard, utilizing the Gerber RS-274-X data provided by our customers.
One of the key features of our SMT PCB stencils is the laser-cut apertures. These precision-engineered openings are designed to match the exact size and shape of the component pads on the PCB, ensuring the solder paste is deposited only on the designated areas. This level of accuracy is crucial for achieving optimal solder joint formation and overall circuit board performance.
To further enhance the usability and compatibility of our SMT stencils, we have incorporated several additional design elements. The squeegee area is strategically located in the center of the stencil, providing an ergonomic and efficient interface for the solder paste application process. Additionally, we have included fiducial marks that are half-etched on the back side of the stencil, enabling seamless integration with SMT assembly machines.
The SMT stencils are meticulously packaged to ensure safe and secure delivery. Each stencil is encased in a sturdy KK carton (hard card) with a protective layer, and typically two stencils are shipped together for added convenience.
Stencil Construction Details:
To provide a deeper understanding of our Laser Cut SMT Stencil 0.12mm Foil, let's delve into the specific construction details:
Item |
Specification |
Frame Dimensions |
584 mm x 584 mm (23" x 23") |
Aperture Sizes |
0201, 0402, 0603 |
Stainless Steel Thickness |
0.12 mm |
Pad Design |
Home Plate |
Profile |
Laser Cut |
0603 Pad Shrinkage |
10% |
Fiducial Marks |
Half etched on back side |
Stencil Statistics:
To provide a more detailed overview of Laser Cut SMT Stencil 0.12mm Foil, let's examine the key statistics:
Statistic |
Value |
Total Components |
78 |
Total Pads |
156 |
0201 Pads |
48 |
0402 Pads |
52 |
0603 Pads |
56 |
Home Plate Pad Design |
26 |
These comprehensive statistics offer valuable insights into the complexity and versatility of our stencil, allowing our customers to assess its suitability for their specific PCB assembly requirements.
Quality Standard and Availability:
The Laser Cut Stencil and Aluminum Framed Laser Cut Stencil adheres to the IPC-Class-2 quality standard, ensuring it meets the rigorous industry requirements for reliability and performance. This stencil is available worldwide, allowing our customers to access this essential tool regardless of their geographic location.
Typical Applications:
The versatility ofthe Laser Cut SMT Stencil 0.12mm Foil makes it suitable for a wide range of surface mount technology (SMT) applications. It can accommodate various SMD (Surface Mount Device) packages, including PLCC, QFP, SOP, SOJ, SOT23, SOT89, SOT143, SOT252, BGA, QFN, and Flip Chip components.
Conclusion:
In summary, our Laser Cut SMT Stencil 0.12mm Foil is a sophisticated and technologically advanced tool that plays a crucial role in the assembly of electronic circuit boards. With its precise laser-cut apertures, robust stainless steel construction, and thoughtful design features, this stencil ensures accurate solder paste deposition, leading to reliable and high-quality PCB assemblies. As a senior sales manager, I am confident in recommending this product to our valued customers, as it exemplifies our commitment to providing innovative solutions that drive excellence in the electronics manufacturing industry.
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