RO3010 PCB 25mil 2-layer Rogers 3010 High Frequency Printed Circuit Board
Welcome to the informative world of Bicheng PCB, where we are thrilled to introduce our latest shipment, the RO3010 PCB 25mil 2-Layer. This cutting-edge technology offers exceptional performance and reliability, making it an ideal solution for a wide range of applications. In this comprehensive article, we will delve into the key properties, construction details, and typical applications of the RO3010 PCB, providing readers with in-depth knowledge about this game-changing technology.
Unveiling the RO3010 PCB 25mil:
The Rogers 3010 high frequency PCB is built using the state-of-the-art Rogers RO3010 ceramic-filled PTFE composites as substrates. These composites offer superior electrical properties, including a dielectric constant of 10.2+/- .30 at 10 GHz/23°C and a dissipation factor of 0.0022 at 10 GHz/23°C. With a thermal conductivity of 0.95 W/mK and a moisture absorption rate of 0.05%, this PCB ensures excellent thermal management and resistance to environmental factors. Furthermore, its high operational temperature range of -40℃ to +85℃ guarantees reliable performance in a variety of conditions.
Features and Benefits :
The Rogers 3010 PCB boasts an array of features that differentiate it from conventional PCBs. Its low coefficient of thermal expansion (CTE) of 13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), and 16 ppm/°C (Z-axis) ensures dimensional stability and compatibility with copper, reducing the risk of failures due to thermal stress. Moreover, this PCB is specifically engineered for volume manufacturing, offering economical laminate pricing without compromising quality.
The stackup of the RO3010 PCB 25mil substrate consists of a 35 μm copper layer on top, followed by the Rogers RO3010 substrate at 25mil (0.635mm) thickness, and another 35 μm copper layer at the bottom. This construction ensures excellent signal integrity and mechanical strength, making it suitable for multi-layer board designs.
Construction Details:
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Construction Details
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Specifications
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Board dimensions
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111.92mm x 81.44 mm
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Quantity
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1 PCS
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Minimum Trace/Space
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4/7 mils
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Minimum Hole Size
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0.5mm
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Blind vias
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No
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Finished board thickness
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0.75mm
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Finished Cu weight
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1 oz (1.4 mils) outer layers
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Via plating thickness
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20 μm
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Surface finish
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Immersion Silver
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Top Silkscreen
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No
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Bottom Silkscreen
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No
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Top Solder Mask
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No
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Bottom Solder Mask
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No
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Electrical test
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100% prior to shipment
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PCB Statistics:
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PCB Statistics
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Quantity
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Components
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35
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Total Pads
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170
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Thru Hole Pads
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113
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Top SMT Pads
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57
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Bottom SMT Pads
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0
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Vias
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79
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Nets
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4
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RO3010 PCB Typical values:
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RO3010 Typical Value
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Property
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RO3010
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Direction
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Units
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Condition
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Test Method
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Dielectric Constant,εProcess
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10.2±0.05
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Z
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10 GHz/23℃
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IPC-TM-650 2.5.5.5 Clamped Stripline
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Dielectric Constant,εDesign
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11.2
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Z
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8GHz to 40 GHz
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Differential Phase Length Method
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Dissipation Factor,tanδ
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0.0022
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Z
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10 GHz/23℃
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IPC-TM-650 2.5.5.5
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Thermal Coefficient of ε
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-395
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Z
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ppm/℃
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10 GHz -50℃to 150℃
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IPC-TM-650 2.5.5.5
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Dimensional Stability
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0.35
0.31
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X
Y
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mm/m
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COND A
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IPC-TM-650 2.2.4
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Volume Resistivity
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105
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MΩ.cm
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COND A
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IPC 2.5.17.1
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Surface Resistivity
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105
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MΩ
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COND A
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IPC 2.5.17.1
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Tensile Modulus
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1902
1934
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X
Y
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MPa
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23℃
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ASTM D 638
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Moisture Absorption
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0.05
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%
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D48/50
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IPC-TM-650 2.6.2.1
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Specific Heat
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0.8
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j/g/k
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Calculated
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Thermal Conductivity
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0.95
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W/M/K
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50℃
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ASTM D 5470
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Coefficient of Thermal Expansion
(-55 to 288℃)
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13
11
16
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X
Y
Z
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ppm/℃
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23℃/50% RH
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IPC-TM-650 2.4.4.1
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Td
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500
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℃ TGA
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ASTM D 3850
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Density
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2.8
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gm/cm3
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23℃
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ASTM D 792
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Copper Peel Stength
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9.4
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Ib/in.
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1oz,EDC After Solder Float
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IPC-TM 2.4.8
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Flammability
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V-0
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UL 94
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Lead-free Process Compatible
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Yes
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Typical Applications :
The Rogers 3010 PCB finds extensive usage in various industries due to its exceptional performance characteristics. Let's explore some typical applications where this PCB excels:
1. Automotive radar applications: The high-frequency capabilities and excellent thermal stability of the RO3010 PCB make it well-suited for automotive radar systems, enabling accurate object detection and collision avoidance.
2. Global positioning satellite antennas: With its low loss and high-frequency performance, the RO3010 PCB ensures optimal signal reception and transmission in GPS antennas, enhancing positioning accuracy.
3. Cellular telecommunications systems: The PCB's low loss and thermal stability make it an ideal choice for power amplifiers and antennas in cellular communication systems, ensuring reliable and efficient signal transmission.
4. Patch antennas for wireless communications: The RO3010 PCB supports the design of patch antennas, facilitating wireless communication in various applications such as IoT devices, routers, and smart home systems.
5. Direct broadcast satellites: The high-frequency capabilities and excellent dimensional stability of the RO3010 PCB make it suitable for use in direct broadcast satellite systems, ensuring reliable data transmission.
6. Datalink on cable systems: The low loss and high-speed capabilities of the RO3010 PCB make it an excellent choice for data links in cable systems, enabling efficient data transfer.
7. Remote meter readers: With itslow moisture absorption, thermal stability, and dimensional stability, the RO3010 PCB is well-suited for remote meter reader applications, ensuring accurate data collection and transmission.
8. Power backplanes: The RO3010 PCB's high thermal conductivity and excellent electrical performance make it an optimal choice for power backplanes, ensuring efficient power distribution and minimizing heat buildup.
Conclusion :
The RO3010 PCB 25mil 2-Layer represents a significant advancement in performance and reliability for advanced electronics. With its exceptional properties and meticulous construction, this Rogers PCB is poised to revolutionize various industries. Contact Bicheng PCB today to explore the endless possibilities of the Rogers RO3010 PCB and witness its unrivaled performance in your next project. Reach out to sales20@bichengpcb.com for any technical inquiries.
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