Rogers RO3035 Microwave PCB 2-Layer Rogers 3035
20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and
RF applications. The high frequency Rogers RO3035 circuit material is made of
PTFE composites filled with ceramic and is designed for RF and industrial
microwave applications. It was created to offer amazing and aggressive costs
while maintaining mechanical and electrical stability.
Regardless of the selected dielectric constant,
they brag of circuit materials with uniform mechanical properties. This enables
the designer to create multilayer board designs using various materials for
each layer's dielectric constant without experiencing reliability or warpage
problems.
The Rogers 3035 materials have extremely stable
dielectric constants with respect to temperature. The materials utilized here
have a 17 ppm/°C CTE (coefficient of thermal expansion) in both the X and Y
axes. The copper coefficient is used to compare this one. As a result, there is
less chance that the material would bow or twist and it can demonstrate
excellent dimensional stability. Additionally, the risk of the thick metal
cladding delaminating is eliminated by the expansion coefficient.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
The Rogers RO3035 has the following features
and properties:
-
Dielectric loss is low
-
Great mechanical properties against temperature
-
Mechanical properties are uniform
-
Dielectric constant is stable versus frequency
and temperature
-
High thermal conductivity
-
In-plane expansion coefficient is low
-
Low loss tangent and dielectric constant
-
Works fine with processing techniques that are
lead-free.
PCB Specifications
|
PCB SIZE
|
77 x 65mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
NO
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 18um(0.5 oz)+plate TOP layer
|
|
RO3035 0.508mm
|
|
copper ------- 18um(0.5 oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
6
mil / 6 mil
|
|
Minimum
/ Maximum Holes:
|
0.4
mm / 5.0 mm
|
|
Number
of Different Holes:
|
3
|
|
Number
of Drill Holes:
|
57
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
1
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3035
0.508mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.6
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3035 (RO3035)
|
RO3035 Typical Value
|
|
Property
|
RO3035
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.50±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
3.6
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.0015
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-45
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.11
0.11
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
107
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
107
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
1025
1006
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.04
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.5
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
17
24
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper Peel
Stength
|
10.2
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
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