Rogers RO4835 High Frequency PCB 10mil
20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General Description:
Rogers
RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative
high frequency materials for applications demanding greater stability at
elevated temperatures. It is significantly more resistant to oxidation than
other hydrocarbon based materials. RO4835 material provides nearly identical electrical and mechanical properties
to RO4350B laminates, which customers have used successfully for many years.
Oxidation
affects all thermoset laminate materials over time and temperature. In the long
term, oxidation can lead to small increases in dielectric constant and
dissipation factor of the circuit substrate.
Features and Benefits:
1.
Significantly improved oxidation resistance compared to typical thermoset
microwave materials, which are designed for performance sensitive, high volume
applications.
2.
Low loss exhibits excellent electrical performance allowing application with
higher operating frequencies, especially ideal for automotive applications.
3.
Tight dielectric constant tolerance results in controlled impedance
transmission lines
4.
Lead-free process compatible results in no blistering or delamination
5.
Low Z-axis expansion results in reliable plated through holes
6.
Low in-plane expansion coefficient remains stable over an entire range of
circuit processing temperatures
7.
CAF resistant
Our PCB Capability (RO4835):
|
PCB Capability (RO4835)
|
|
PCB Material:
|
Hydrocarbon
Ceramic Laminates
|
|
Designation:
|
RO4835
|
|
Dielectric constant:
|
3.48 (10 GHz)
|
|
Dissipation Factor
|
0.0037 (10 GHz)
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
Dielectric thickness
(ED copper)
|
6.6mil
(0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
|
|
Dielectric
thickness (LoPro copper)
|
4mil (0.102mm),
7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm),
60.7mil (1.542mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
|
Typical Applications:
1.
Automotive Radar and Sensors
2.
Point-to point Microwave
3.
Power Amplifiers
4.
Phased - Array Radar
5.
RF Components
Appendix: Typical Values of RO4835:
|
Property
|
RO4835
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.48±0.05
|
Z
|
-
|
10
GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.66
|
Z
|
-
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0037
|
Z
|
-
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+50
|
Z
|
ppm/℃
|
-100℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
5
x 108
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
7
x108
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
30.2(755)
|
Z
|
Kv/mm(v/mil)
|
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
7780(1128)
|
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
136(19.7)
|
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
186
(27)
|
|
Mpa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.5
|
X,Y
|
mm/m
(mils/inch)
|
after
etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
10
12
31
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
390
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.66
|
|
W/m/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.05
|
|
%
|
48hrs immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.92
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
0.88
(5.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
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