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Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.
Item NO.:
BIC-138-v180.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TC350Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Low moisture absorption, superior dimensional stability, and lower tangent and insertion loss are all characteristics of the new material. The TC350 Plus materials' low loss tangent and high thermal conductivity qualities contribute to the panels' increased dependability and lower operating temperatures. They come in a variety of sizes as well. We can employ them for a variety of purposes as a result. In addition, they are a popular option for high-power applications like telecommunications.
Rogers Electronics' RO4835 high-frequency laminates have a 3.48 dielectric constant and increased oxidation resistance. They have a low loss tangent at 10 GHz and work with lead-free processing techniques. They are suitable for demanding RF/microwave circuits due to their low loss tangent and excellent electrical stability. They are RoHS-compliant and have expansion coefficients that are comparable to copper's.
For applications with a wide range of mechanical, electrical, and mechanical requirements, high-frequency laminates are preferable. Low loss tangents are exhibited by Rogers TC350 Plus laminates, which lowers the price of a high-frequency board. When selecting the ideal material for your circuit boards, the loss factor, or Df, is a crucial component to take into account. It is a fundamental feature of a printed circuit board, and the material used to make it is the main deciding element. For instance, you will suffer greater losses if you employ FR-4 materials.
Features & Benefits:
1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.
2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.
3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.
Our PCB Capabilities (TC350)
Our PCB Capability (TC350) | |
PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: | TC350 |
Dielectric constant: | 3.5±0.05 |
Thermal Conductivity | 0.72 W/m-K |
Dissipation Factor | Df .002@10 GHz |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Applications:
1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
4. Thermally Cycled Antennas sensitive to dielectric drift
Typical Properties of TC350:
Typical Properties:TC350 | |||
Property | Units | Value | Test Merthod |
1. Electrical Properties | |||
Dielectric Constant (may vary by thickness) | |||
@1 MHz | - | 3.50 | IPC TM-650 2.5.5.3 |
@1.8 GHz | - | 3.50 | RESONANT CAVITY |
@10 GHz | - | 3.50 | IPC TM-650 2.5.5.5 |
Dissipation Factor | |||
@1 MHz | - | 0.0015 | IPC TM-650 2.5.5.3 |
@1.8 GHz | - | 0.0018 | RESONANT CAVITY |
@10 GHz | - | 0.0020 | IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric | - | ||
TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
Volume Resistivity | |||
C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ-cm | 1.4x108 | |
Surface Resistivity | |||
C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
2.Thermal Properties | |||
Decomposition Temperature (Td) | |||
Initial | °C | 520 | IPC TM-650 2.4.24.6 |
5% | °C | 567 | IPC TM-650 2.4.24.6 |
T260 | min | >60 | IPC TM-650 2.4.24.1 |
T288 | min | >60 | IPC TM-650 2.4.24.1 |
T300 | min | >60 | IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
3. Mechanical Properties | |||
Peel Strength to Copper (1 oz/35 micron) | |||
After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
Poisson’s Ratio | - | ASTM D-3039 | |
4. Physical Properties | |||
Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
Thermal Conductivity | W/mK | 0.72 | ASTMD5470 |
Specific Heat | J/gK | 0.90 | ASTM D5470 |
Flammability | class | V0 | UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr | |||
Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
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