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Home Taconic PCB Board Taconic High Frequency PCB Built on TLX-9 62mil 1.575mm With Immersion Silver

Taconic High Frequency PCB Built on TLX-9 62mil 1.575mm With Immersion Silver

TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs

  • Item NO.:

    BIC-029-v105.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Taconic High Frequency PCB Built on TLX-9 62mil 1.575mm With Immersion Silver for Mixers, Splitters, Filters & Combiners

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.


TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.

 

There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).


Taconic PCB Bicheng


Benefits:


Excellent mechanical & thermal properties

Low & stable DK

Dimensionally stable

Low moisture absorption

UL 94 V-O rating

Tightly controlled DK

Low DF

For low layer count microwave designs


Applications:

Antennas

Couplers, Splitters, Combiners,

Amplifiers, Mixers, Filters

Passive components


PCB Specifications:


PCB SIZE 134 x 59mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
TLX-9 1.575mm
copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 15 mil / 15 mil
Minimum / Maximum Holes: 0.4mm/3.5mm
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  TLX-9 1.575mm
Final foil external:  1 oz
Final foil internal:  N/A
Final height of PCB:  1.6 mm ±10%
PLATING AND COATING
Surface Finish Immersion Silver
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


TLX-9 Typical Value:


TLX-9 TYPICAL VALUES
Property Test Method Units Value Units Value
Dielectric Constant @ 10 GHz IPC-TM 650 2.5.5.5 2.5 2.5
Dissipation Factor @ 10 GHz IPC-TM 650 2.5.5.5 0.0019 0.0019
Moisture Absorption IPC-TM 650 2.6.2.1 % <0.02 % <0.02
Dielectric Breakdown IPC-TM 650 2.5.6 kV >60 kV >60
Volume Resistivity IPC-TM 650 2.5.17.1 Mohm/cm 10^7 Mohm/cm 10^7
Surface Resistivity IPC-TM 650 2.5.17.1 Mohm 10^7 Mohm/cm 10^7
Arc Resistance IPC-TM 650 2.5.1 seconds >180 seconds >180
Flexural Strength Lengthwise IPC-TM 650 2.4.4 lbs./in. >23,000 N/mm2 >159
Flexural Strength Crosswise IPC-TM 650 2.4.4 lbs./in. >19,000 N/mm2 >131
Peel Strength (1oz copper) IPC-TM 650 2.4.8 lbs./linear in. 12 N/mm 2.1
Thermal Conductivity ASTM F 433 W/m/K 0.19 W/m/K 0.19
x-y CTE ASTM D 3386 (TMA) ppm/°C 9-12 ppm/°C 9-12
z CTE ASTM D 3386 (TMA) ppm/°C 130- 145 ppm/°C 130- 145
UL-94 Flammability Rating UL-94 V-0 V-0


DK TLX-9


Type DK
TLY-5A 2.17
TLY-5 2.20
TLY-3 2.33
TLT-0 TLX-0 2.45
TLT-9 TLX-9 2.50
TLT-8 TLX-8 2.55
TLT-7 TLX-7 2.60
TLT-6 TLX-6 2.65
TLE-95 2.95
TLC-27 2.75
TLC-30 RF-30 3.00
TLC-32 3.20
TLF-35 3.50
TLF-35-xxxx-A 3.50
RF-35 RF-35A2 3.50
TRF-41 4.10
TRF-43 4.30
TRF-45 4.50
RF-60A 6.15
CER-10 10



MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

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