Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.
RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.
Benefits:
Low loss properties
DK tolerance of +/- 0.05
Homogeneous DK
Excellent peel strength
Low moisture absorption
Our PCB Capability (RF-35A2):
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PCB Capability (RF-35A2)
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PCB Material:
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PTFE Ceramic
Fiberglass
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Designation:
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RF-35A2
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Dielectric constant:
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3.15
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Dissipation Factor
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0.0015
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Layer count:
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Double Layer, Multilayer, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm)
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PCB thickness:
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10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
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Applications:
Power amplifiers
Filters / couplers
High speed digital
Passive components
Wireless antennas
RF-35A2 Typical Values:
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RF-35A2
Typical Values
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Property
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Test Method
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Unit
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Value
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Unit
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Value
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Dk @ 10 GHz
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IPC-650 2.5.5.5.1(Modified)
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3.5
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3.5
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Df @ 10 GHz
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IPC-650 2.5.5.5.1(Modified)
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0.0015
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0.0015
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Moisture Absorption
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IPC-650 2.6.2.1
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%
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0.03
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%
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0.03
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Dielectric Breakdown
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IPC-650 2.5.6/ASTM D
149
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kV
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59
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kV
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59
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Dielectric Strength
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ASTM D 149
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V/mil
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1000
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V/mm
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39,370
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Volume Resistivity
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IPC-650 2.5.17.1 Sec.
5.2.1(Humidity Cond.)
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Mohm/cm
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10^9
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Mohm/cm
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10^9
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Surface Resistivity
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IPC-650 2.5.17.1 Sec.
5.2.1(Humidity Cond.)
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Mohm
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10^8
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Mohm
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10^8
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Arc Resistance
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IPC-650 2.5.1
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Seconds
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242
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Seconds
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242
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Flexural Strength(MD)
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IPC-650 2.4.4
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kpsi
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24
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N/mm2
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165
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Flexural Strength(CD)
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IPC-650 2.4.4
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kpsi
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15
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N/mm2
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103
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Tensile Strength(MD)
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ASTM D 3039
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psi
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16,800
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N/mm2
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116
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Tensile Strength(CD)
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ASTM D 3039
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psi
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11,000
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N/mm2
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75.8
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Young’s Modulus(MD)
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ASTM D 3039
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psi
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106
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N/mm2
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8,343
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Young’s Modulus(CD)
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ASTM D 3039
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psi
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106
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N/mm2
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7,171
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Poisson’s Ratio(MD)
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ASTM D 3039
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0.14
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0.14
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Poisson’s Ratio(CD)
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ASTM D 3039
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0.1
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0.1
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Strain at Break(MD)
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ASTM D 3039
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%
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1.6
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%
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1.6
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Strain at Break(CD)
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ASTM D 3039
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%
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1.4
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%
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1.4
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Compressive Modulus (Z
axis)
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ASTM D 695(23°C)
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kpsi
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385
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N/mm2
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2,650
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Peel Strength(1 oz. VLP)
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IPC-650 2.4.8(Thermal Stress)
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lbs/in
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12
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N/mm
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2.1
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Peel Strength(1 oz. VLP)
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IPC-650 2.4.8.3 (150°C )(Elevated
Temp.)
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lbs/in
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14
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N/mm
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2.5
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Peel Strength(1 oz. VLP)
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IPC-650 2.4.8 Sec.
5.2.3(Proc. Chemicals)
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lbs/in
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11
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N/mm
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2
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Density(Specific Gravity)
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gm/cm3
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2.28
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gm/cm3
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2.28
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Specific Heat
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ASTM E 1269 (DSC)(100°C)
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J/g/K
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0.99
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J/g/K
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0.99
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Thermal Conductivity
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ASTM F 433
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W/M*K
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0.29
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W/M*K
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0.29
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Td
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IPC-650 2.4.24.6 2% Weight Loss
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°C
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528
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°C
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528
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Td
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IPC-650 2.4.24.65% Weight Loss
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°C
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547
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°C
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547
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CTE (x)
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IPC-650 2.4.41 (>RT - 125°C)
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ppm/°C
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10
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ppm/°C
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10
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CTE (y)
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IPC-650 2.4.41(>RT - 125°C)
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ppm/°C
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13
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ppm/°C
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13
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CTE (z)
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IPC-650 2.4.41(>RT - 125°C)
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ppm/°C
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108
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ppm/°C
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108
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