TMM10i PCB 60mil Microwave Rogers Material
Introduction
There is about Rogers TMM10i PCB, a thermoset microwave material with isotropic properties that are ideal for strip-line and micro-strip applications requiring high reliability and plated thru-hole connections.
TMM10i thermoset microwave materials consist of a blend of ceramics, hydrocarbons, and thermoset polymers. These materials offer a unique combination of electrical and mechanical characteristics, drawing on the benefits of both ceramic and traditional PTFE microwave circuit laminates.
TMM10i laminates possess an impressively low TCDk value. The material's isotropic coefficient of thermal expansion (CTE), closely matching that of copper, enables the production of reliable plated through holes and ensures minimal etch shrinkage. Additionally, TMM10i has double the thermal conductivity of traditional PTFE/ceramic laminates, allowing for efficient heat dissipation.
Now, let's delve into the data sheet for TMM10i and explore its properties in more detail.
TMM10i Typical Properties
Starting with the electrical characteristics, TMM10i exhibits a process dielectric constant of 9.80±0.245 in the Z-direction at 10 GHz (measured using IPC-TM-650 2.5.5.5). Across a frequency range of 8 GHz to 40 GHz (measured using the Differential Phase Length Method), the design dielectric constant slightly increases to 9.9.
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Property
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TMM10i
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Direction
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Units
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Condition
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Test Method
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Dielectric Constant,εProcess
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9.80±0.245
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Z
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10 GHz
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IPC-TM-650 2.5.5.5
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Dielectric Constant,εDesign
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9.9
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-
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-
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8GHz to 40 GHz
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Differential Phase Length Method
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Dissipation Factor (process)
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0.002
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Z
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-
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10 GHz
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IPC-TM-650 2.5.5.5
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Thermal Coefficient of dielectric constant
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-43
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-
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ppm/°K
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-55℃-125℃
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IPC-TM-650 2.5.5.5
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Insulation Resistance
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>2000
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-
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Gohm
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C/96/60/95
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ASTM D257
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Volume Resistivity
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2 x 108
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-
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Mohm.cm
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-
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ASTM D257
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Surface Resistivity
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4 x 107
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-
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Mohm
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-
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ASTM D257
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Electrical Strength (dielectric strength)
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267
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Z
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V/mil
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-
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IPC-TM-650 method 2.5.6.2
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Thermal Properties
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Decompositioin Temperature(Td)
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425
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425
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℃TGA
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-
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ASTM D3850
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Coefficient of Thermal Expansion - X
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19
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X
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ppm/K
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0 to 140℃
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ASTM E 831 IPC-TM-650, 2.4.41
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Coefficient of Thermal Expansion - Y
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19
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Y
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ppm/K
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0 to 140℃
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ASTM E 831 IPC-TM-650, 2.4.41
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Coefficient of Thermal Expansion - Z
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20
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Z
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ppm/K
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0 to 140℃
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ASTM E 831 IPC-TM-650, 2.4.41
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Thermal Conductivity
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0.76
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Z
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W/m/K
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80℃
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ASTM C518
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Mechanical Properties
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Copper Peel Strength after Thermal Stress
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5.0 (0.9)
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X,Y
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lb/inch (N/mm)
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after solder float 1 oz. EDC
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IPC-TM-650 Method 2.4.8
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Flexural Modulus (MD/CMD)
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1.8
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X,Y
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Mpsi
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A
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ASTM D790
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Physical Properties
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Moisture Absorption (2X2)
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1.27mm (0.050")
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0.16
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-
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%
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D/24/23
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ASTM D570
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3.18mm (0.125")
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0.13
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Specific Gravity
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2.77
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-
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-
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A
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ASTM D792
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Specific Heat Capacity
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0.72
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-
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J/g/K
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A
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Calculated
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Lead-Free Process Compatible
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YES
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-
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-
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-
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-
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TMM10iPCB Capability
Now, let's closely examine the capabilities of our PCBs.
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PCB material:
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Ceramic, Hydrocarbon, Thermoset Polymer Composites
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Designation:
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TMM10i
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Dielectric constant:
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9.80 ±0.245
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Layer count:
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Double Layer, Multilayer, Hybrid PCB
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Copper weight:
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1oz (35µm), 2oz (70µm)
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Laminate thickness:
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15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red, Purple etc.
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Surface finish:
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Immersion gold, HASL, Immersion tin, Immersion silver, OSP, Pure Gold Plated, ENEPIG, Bare copper etc..
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A Piece of TMM10i PCB
Displayed is an example of a circuit board made with TMM10i 60mil material, featuring a thickness of 60mil and coated with immersion silver. This particular PCB is suitable for power combiner applications.
Rogers TMM10i PCB has versatile applications in RF microwave circuitry, power amplifiers, filters and couplers, satellite communication systems, global positioning system antennas, patch antennas, dielectric polarizers, chip testers, and more.
Conclusion
TMM10i Rogers materials are renowned for their temperature stability, thanks to the hydrocarbon matrix heavily filled with ceramic particles. These ceramic fillers contribute to the low thermal expansion exhibited by TMM10i materials.
However, when drilling TMM10i 60mil materials, precautions must be taken due to the abrasive nature of the ceramic filler. It is advisable to avoid high tool surface speeds exceeding 500 SFM and low chip loads below 0.002" per revolution to prevent excessive heat and tool wear.
If you're interested in machining TMM10i laminates, you'll be pleased to know that they can be routed using conventional carbide tools. By selecting appropriate routing conditions and tools, you can achieve a useful tool life of over 250 linear inches.
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