TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

Taconic TSM-DS3 board has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling.

Item NO.:
BIC-226-v277.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$99
Price Range:1 - 50/$2.9
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This TSM-DS3 board is a 2-layer rigid PCB with specific construction details and specifications. The board utilizes copper layers on both sides, each with a thickness of 35 μm. The core material used is Taconic TSM-DS3 PCB with a thickness of 0.762 mm (30mil). The overall finished board thickness is 0.88mm.

The 30mil TSM-DS3 board has dimensions of 120mm x 75mm with a tolerance of +/- 0.15mm. The minimum trace/space is 7/8 mils, indicating the minimum width of conductive traces and the minimum spacing between them. The minimum hole size is 0.3mm.

The finished copper weight is 1oz (1.4 mils) on the outer layers and the via plating thickness is 20 μm. The surface finish is immersion gold, providing a protective and conductive layer on the surface of the PCB.

The TSM-DS3 PCB has a black top silkscreen and there is no bottom silkscreen or top/bottom solder mask. The boards undergo a 100% electrical test to ensure its functionality prior to shipment.

30mil TSM-DS3 PCB

PCB Specifications

PCB SIZE	120 x 75mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	TSM-DS3 0.762mm
	copper ------- 18um(0.5oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7 mil / 8 mil
Minimum / Maximum Holes:	0.3 mm / 2.5 mm
Number of Different Holes:	11
Number of Drill Holes:	72
Number of Milled Slots:	1
Number of Internal Cutouts:	1
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Ceramic-filled Fiberglass	TSM-DS3
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	0.88 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold, 49%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	Black
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	94 V0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

OurPCB Capability (2024)

Factory Process Capability (2024)
Substrate Types and Brands	Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Substrate Types and Brands	Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types	Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model	High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115
	Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250.
	Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
	Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615. Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size	1200mm x 572 mm
Minimum Finished Board Thickness	L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness	10.0 mm
Blind Buried Holes (Non-crossing)	0.1mm
Maximum Hole Aspect Ratio	15:01
Minimum Mechanical Drill Hole Diameter	0.1 mm
Through-hole Tolerance	+/- 0.0762 mm
Press-fit Hole Tolerance	+/- 0.05mm
Non-plated Copper Hole Tolerance	+/- 0.05mm
Maximum Number of Layers	32
Internal and External Layer Maximum Copper Thickness	12Oz
Minimum Drill Hole Tolerance	+/- 2mil
Minimum Layer-to-Layer Tolerance	+/- 3mil
Minimum Line Width/Spacing	3mil/3mil
Minimum BGA Diameter	8mil
Impedance Tolerance	< 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes	Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.

University Collaboration

BICHENG PCB CERTIFICATE:

Top 10 Sales of Rogers PCB

Major material Supplier

Hot Tags :

Taconic TSM-DS3 PCB TSM-DS3 30 mil PCB TSM-DS3 30 mil PCB Substrate 0.762 mm Taconic Substrate Double Sided TSM-DS3 PCB Boards TSM-DS3 PCB Immersion Gold

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Subject : TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold

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