Via
Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With
Blind Via for GPS Tracking
(Printed
circuits boards are custom-made products, the picture and parameters shown are
just for reference)
1.1
General description
It's only 0.6 mm thick
without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The
base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with
0.25mm areresin filled and capped (via in pad). They're fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 50 panels are packed for
shipment.
1.2
Features and benefits
1.
Via in pad design reduced the inductive reactance and capacitive reactance of
the transmission line;
2.
Immersion gold finish has high solderability, no stressing of circuit boards
and less contamination of PCB surface;
3. Products
and manufacturing are certified by authorized organizations;
4.
Eligible products rate of first production: >95%;
5.
Prototype PCB capability to volume production capability;
6. Delivery
on time: >98%;
7.
More than 18+ years of PCB experience;
8.
IPC Class 2 / IPC Class 3;
1.3
Applications
Led
Lighting
Intercom
System
Portable
WiFi Router
GSM
Tracker
Commercial
Led Lighting
Modem
WiFi 4G
Honeywell
Access Control
Electronic
Access Control
Audio
Frequency Amplifier
File
servers
1.4
PCB Specifications
|
PCB SIZE
|
100 x
103mm=1PCS
|
|
BOARD TYPE
|
Multilayer PCB
|
|
Number
of Layers
|
6 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 18um(0.5oz)+plate TOP CS
|
|
4mil prepreg
|
|
copper ------- 18um(0.5oz) GND Plane
|
|
4mil FR-4
|
|
copper ------- 18um(0.5oz) PWR Plane
|
|
4mil prepreg
|
|
copper ------- 18um(0.5oz) PWR Plane
|
|
4mil FR-4
|
|
copper ------- 18um(0.5oz) SIG
|
|
4mil prepreg
|
|
copper ------- 18um(0.5oz) BOT PS
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
3mil/3mil
|
|
Minimum
/ Maximum Holes:
|
0.22/3.50mm
|
|
Number
of Different Holes:
|
25
|
|
Number
of Drill Holes:
|
2315
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control
|
no
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
FR-4,
ITEQ IT140 TG>135, er<5.4
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
0.5oz
|
|
Final
height of PCB:
|
0.6mm
±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
0.025µm over 3µm Nickel (14.4% area)
|
|
Solder
Mask Apply To:
|
TOP and Bottom,
12micron Minimum
|
|
Solder
Mask Color:
|
Green, TAIYO
PSR-2000 GT600D
|
|
Solder
Mask Type:
|
LPSM
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
No
silkscreen requried.
|
|
Colour
of Component Legend
|
No silkscreen
requried.
|
|
Manufacturer
Name or Logo:
|
No silkscreen
requried.
|
|
VIA
|
Plated
through hole(PTH), Blind via and via
capping on CS and PS, vias not be visible.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
(0.15mm)
|
|
Board
plating:
|
0.0030"
(0.076mm)
|
|
Drill
tolerance:
|
0.002"
(0.05mm)
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
1.5
via in pad (VIP)
At
present, the circuit board is becoming more and more dense and interconnected,
and there is no more room for these wires and pads connecting the holes.
Therefore, so in this context, the process of punching the holes on the pads
arises at the historic moment. In brief, the via holes which have been plated
through are plugged or filled by insulating resin through the method of screen
leakage, and then drying, grinding, and then electroplating, so that the whole
surface of the PCB is coated with copper, and no longer via holes can be seen.
The
effect of via in pad is also very obvious: such as improved the electrical performance
and reliability of electronic products, shorten the signal transmission wire,
reduced the inductive reactance and capacitive reactance of the transmission
line, and reduced internal and external electromagnetic interference.
Let’s
see the basic process of via in pad.
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