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Home Newly Shipped RF PCB F4BTM450 PCB 2-layer 3.2mm Thick High Frequency Circuit Laminate

F4BTM450 PCB 2-layer 3.2mm Thick High Frequency Circuit Laminate


The F4BTM series high-frequency circuit laminates offers exceptional performance and reliability for a wide range of applications.



  • Item NO.:

    BIC-240-v305.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


 

F4BTM450 PCB 2-layer 3.2mm ThickHigh Frequency Circuit Laminate

 

Introduction

The F4BTM series of high-frequency circuit laminates offers exceptional performance and reliability for a wide range of applications. These laminates are engineered using a combination of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, undergoing rigorous preparation and pressing processes. The F4BTM series is based on the F4BM dielectric layer and incorporates high-dielectric and low-loss nanoscale ceramics. This unique composition results in a higher dielectric constant, improved heat resistance, reduced coefficient of thermal expansion, enhanced insulation resistance, and superior thermal conductivity. These advancements are achieved while maintaining the low-loss characteristics of the material.

 

Features of F4BTM450

The F4BTM450 variant of the series exhibits outstanding specifications, making it an ideal choice for high-frequency applications. Here are the key features of the F4BTM450 PCB:

 

1)Dielectric Constant (Dk) of 4.5 at 10GHz:

The F4BTM450 offers a precisely controlled dielectric constant, ensuring reliable signal propagation and reduced signal loss at high frequencies.

 

2)Dissipation Factor of .002 at 10GHz:

With an impressively low dissipation factor, the F4BTM450 minimizes energy loss during signal transmission, resulting in improved signal integrity.

 

3)Coefficient of Thermal Expansion (CTE):

CTE x-axis: 10 ppm/°C

CTE y-axis: 12 ppm/°C

CTE z-axis: 51 ppm/°C

These CTE values indicate the excellent dimensional stability of the F4BTM450 across various temperatures, enabling reliable performance in demanding environments ranging from -55°C to 288°C.

 

4)Low Thermal Coefficient of Dk:

The F4BTM450 exhibits a low thermal coefficient of dielectric constant, with a range of -60 ppm/°C from -55°C to 150°C. This characteristic ensures consistent electrical performance under temperature variations.

 

5)Minimal Moisture Absorption:

With a moisture absorption rate of only 0.05%, the F4BTM450 maintains its electrical and mechanical properties even in humid conditions, making it suitable for diverse environments.

 

F4BTM450 PCB

 

PCB Construction and Specifications:

The F4BTM450 PCB is a 2-layer rigid board designed to meet the requirements of high-frequency applications. Here are the construction details and specifications:

Construction Details

Value

Board dimensions

63mm x 63 mm = 1PCS

Tolerance

+/- 0.15mm

Minimum Trace/Space

6/8 mils

Minimum Hole Size

0.4mm

Blind vias

No

Finished board thickness

3.1mm

Finished Cu weight

1oz (1.4 mils) outer layers

Via plating thickness

20 μm

Surface finish

Immersion Gold

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Black

Bottom Solder Mask

No

Electrical test

100% prior to shipment

 

 

 

PCB Statistics

The F4BTM450 PCB exhibits the following statistics, reflecting its versatility and compatibility with various applications:

PCB Statistics

Value

Components

31

Total Pads

59

Thru Hole Pads

32

Top SMT Pads

27

Bottom SMT Pads

0

Vias

28

Nets

3

 

 

 

Quality Standards and Availability

The F4BTM450 PCB adheres to IPC-Class-2 quality standards, ensuring high-quality manufacturing and reliability. With worldwide availability, customers can benefit from this exceptional high-frequency circuit laminate for their projects globally.

 

Typical Applications

The F4BTM450 PCB finds its application in various industries and sectors, including:

 

Aerospace Equipment:

The high-frequency performance and reliability of the F4BTM450 make it suitable for aerospace equipment, both in space and cabin applications.

 

Microwave and RF:

The F4BTM450 is well-suited for microwave and RF applications, providing excellent signal transmission and low-losscharacteristics.

 

Radar and Military Radar:

With its enhanced dielectric properties and low-loss characteristics, the F4BTM450 is an ideal choice for radar systems, including military radar applications.

 

Feed Networks:

The F4BTM450 PCB is capable of supporting feed networks, enabling efficient signal distribution in communication systems.

 

Phase-Sensitive Antennas and Phased Array Antennas:

The F4BTM450's high-frequency capabilities and reliable performance make it suitable for phase-sensitive antennas and phased array antennas, ensuring accurate signal reception and transmission.

 

Satellite Communications:

The F4BTM450 PCB is well-suited for satellite communication systems, offering excellent signal integrity and reliability in the demanding space environment.

 

In conclusion, the F4BTM450 PCB is a high-frequency circuit laminate that combines advanced materials and superior manufacturing processes to deliver exceptional performance and reliability. With its enhanced dielectric properties, low-loss characteristics, and excellent thermal stability, it is an ideal choice for a wide range of applications, including aerospace equipment, microwave and RF systems, radar systems, feed networks, phase-sensitive antennas, phased array antennas, and satellite communications. Adhering to rigorous quality standards and available worldwide, the F4BTM450 PCB offers engineers and manufacturers a reliable solution for their high-frequency circuitry needs.



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