Hybrid PCB with RO4003C and S1000-2 Materials Multilayer 6-layer RF Circuit Board

Hybrid PCB with RO4003C and S1000-2 Materials Multilayer 6-layer RF Circuit Board

Introduction

Our Hybrid PCB, featuring a combination of RO4003C and S1000-2 materials, offers exceptional performance and versatility for various applications. This advanced PCB leverages the unique characteristics of each material to achieve a balance between high-frequency performance, cost-effectiveness, and reliability. With a 6-layer rigid PCB construction and precise manufacturing processes, our Hybrid PCB is designed to meet the demands of modern electronic designs.

RO4003C and S1000-2 Materials

RO4003C high frequency material is a proprietary woven glass reinforced hydrocarbon/ceramic laminate that delivers outstanding electrical performance comparable to PTFE-based microwave materials but at a fraction of the cost. It offers a tight control on dielectric constant (Dk) and low loss, making it ideal for RF and microwave applications. Unlike PTFE-based materials,Mutilayer RO4003C PCB does not require special through-hole treatments or handling procedures.

S1000-2, on the other hand, is an epoxy glass (FR-4) laminate developed by Shengyi. It is a lead-free compatible material with high thermal resistance and a Tg (glass transition temperature) of 170°C, ensuring optimal performance even under demanding conditions. S1000-2 exhibits excellent through-hole reliability, anti-conductive anodic filament (CAF) performance, and low water absorption.

Features of RO4003C

RO4003C boasts several key features that make it an exceptional high-frequency laminate:

1)Dielectric Constant (Dk):

RO4003C offers a Dk of 3.38 +/- 0.05, ensuring accurate signal transmission and minimal signal loss.

2)Dissipation Factor:

With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal attenuation, enabling high-speed data transfer and efficient RF performance.

3)Z-Axis Coefficient of Thermal Expansion (CTE): 

Z-The low Z-axis CTE of 46 ppm/°C ensures dimensional stability and reliable performance across a wide temperature range.

Features of S1000-2

S1000-2 exhibits the following notable features:

1)Lead-Free Compatible:

The FR-4.0 laminate is environmentally friendly and complies with lead-free requirements, making it suitable for modern electronics manufacturing.

2)High Thermal Resistance and Tg:

With a Tg of 170°C, S1000-2 can withstand elevated temperatures during assembly and operation, ensuring long-term reliability.

3)Low Z-Axis CTE:

The low Z-axis CTE of 45 ppm/°C (before Tg) minimizes the risk of delamination and ensures dimensional stability under varying thermal conditions.

4)Excellent Through-Hole Reliability:

S1000-2 provides robust through-hole reliability, minimizing the risk of open circuits or failure in critical interconnections.

Hybrid PCB Design

Hybrid RO4003C FR-4 PCB combines the strengths of RO4003C and S1000-2 to optimize performance and cost-effectiveness. The 6-layer rigid construction consists of alternating layers of RO4003C and S1000-2 cores, with copper layers for signal transmission and power distribution.

The stack-up of our Hybrid PCB is as follows:

This stack-up ensures optimal signal integrity and allows for the integration of high-frequency components while maintaining cost-effectiveness in non-critical areas.

HybridPCB Construction Details

Hybrid RF circuit board is meticulously crafted with attention to detail and adherence to industry standards. Here are the construction details:

PCB Statistics

The hybrid circuit board boasts the following statistics:

Artwork and Quality Standard

The Hybrid PCB is designed and manufactured based on the Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software and manufacturing processes. The PCB adheres to the IPC-Class-2 quality standard, guaranteeing excellent workmanship, reliability, and performance.

Availability

Hybrid PCB is available worldwide, catering to the needs of customers across various industries and geographical locations. We offer efficient order processing, timely delivery, and exceptional customer support to ensure a seamless purchasing experience.

Typical Applications

The Hybrid PCB finds applications in a wide range of industries and electronic devices. Some typical applications include:

1)Point-to-Point Digital Radio Antennas:

The PCB enables high-frequency signal transmission in digital radio antennas, ensuring reliable and efficient communication.

2)Cellular Base Station Antennas and Power Amplifiers:

It supports the development of cellular base station antennas and power amplifiers, delivering enhanced signal strength and coverage.

3)RF Identification Tags:

The Hybrid PCB facilitates the manufacture of RF identification tags for tracking and identification purposes in various industries.

4)Automotive Radar and Sensors:

It enables the integration of radar systems and sensors in automotive applications, enhancing safety and driver assistance features.

5)LNBs for Direct Broadcast Satellites:

The PCB plays a crucial role in the production of low-noise block downconverters (LNBs) used in direct broadcast satellite systems, ensuring high-quality signal reception.

Conclusion

Our Hybrid PCB, featuring a combination of RO4003C and S1000-2 materials, offers exceptional performance, reliability, and cost-effectiveness. With its high-frequency capabilities, precise construction, and compatibility with various applications, this PCB provides a versatile solution for demanding electronic designs. Whether you require reliable RF transmission, efficient power distribution, or robust interconnections, our Hybrid multilayer RO4003C FR-4 PCB is the ideal choice. Experience the benefits of advanced materials and expert craftsmanship with our Hybrid PCB for your next electronic project.