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RO4003C PCB meets the demands of performance-sensitive industries worldwide. Whether it's for cellular base stations, RF identification systems, automotive radar, or satellite communication, the RO4003C PCB delivers reliable and efficient performance, ensuring the success of your advanced electronic designs.
Item NO.:
BIC-245-v310.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4003C PCB 8mil 0.203mm Rogers 4003C High Frequency Circuit Board Immersion Gold
Introduction
The RO4003C PCB, featuring a cutting-edge laminate material, is designed to meet the demanding requirements of high-frequency microwave applications. RO4003C laminates combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass, offering exceptional signal integrity and cost-efficiency. With its unique properties and impressive specifications, Rogers RO4003C PCBs are ideal for a wide range of applications where precision and reliability are paramount.
Enhanced Material Performance
RO4003C laminates utilize proprietary woven glass reinforced hydrocarbon/ceramic materials, providing exceptional electrical performance and manufacturability. These laminates incorporate 1080 and 1674 glass fabric styles, all meeting the same stringent electrical specifications. With tight control over the dielectric constant (Dk) and low loss characteristics, RO4003C laminates offer outstanding signal integrity and ensure reliable performance.
Unlike PTFE-based microwave materials, RO4003C 8mil laminates do not require special through-hole treatments or handling procedures, simplifying the manufacturing process and reducing costs. Furthermore, the non-brominated composition of RO4003C materials makes them environmentally friendly and complies with industry regulations.
Impressive Features
The RO4003C data sheet offers a range of features that make it a top choice for high-frequency applications:
1)Dielectric Constant (DK):
Rogers RO4003C dielectric constant With a DK of 3.38 +/-0.05 at 10GHz, the RO4003C PCB provides excellent signal stability and minimal signal loss, ensuring reliable performance in demanding microwave circuits.
2)Dissipation Factor:
The RO4003C PCB exhibits an extremely low dissipation factor of 0.0027 at 10GHz and 0.0021 at 2.5GHz. This low loss characteristic allows for efficient signal transmission and reduces the impact of signal attenuation.
3)Thermal Coefficient:
The thermal coefficient of the dielectric constant is +40 ppm/°C, ensuring the stability of electrical properties over a wide temperature range. The RO4003C PCB maintains its high-quality performance even in extreme thermal conditions.
4)Thermal Conductivity:
With a thermal conductivity of 0.71 W/m/°K, the RO4003C PCB efficiently dissipates heat, reducing the risk of thermal damage to sensitive components and ensuring optimal performance.
5)Coefficient of Thermal Expansion (CTE):
The RO4003C PCB exhibits an X-axis CTE of 11ppm/°C, Y-axis CTE of 14ppm/°C, and Z-axis CTE of 46ppm/°C. This balanced CTE profile ensures dimensional stability and reliable plated through-hole quality, even in applications with severe thermal shock.
6)Low Moisture Absorption:
The RO4003C PCB has a moisture absorption rate of only 0.06%, minimizing the risk of delamination and ensuring long-term reliability in humid or damp environments.
RogersRO4003C data sheet:
RO4003C Typical Value |
|||||
Property |
RO4003C |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.38±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.55 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0027 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+40 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.7 x 1010 |
|
MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
4.2 x 109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
19,650(2,850) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
139(20.2) |
X |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
276 |
|
MPa |
|
IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
11 |
X |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
|
℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
425 |
|
℃ TGA |
|
ASTM D 3850 |
Thermal Conductivity |
0.71 |
|
W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
|
% |
48hrs immersion 0.060" |
ASTM D 570 |
Density |
1.79 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
1.05 |
|
N/mm |
after solder float 1 oz. |
IPC-TM-650 2.4.8 |
Flammability |
N/A |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|
Key Benefits
Rogers 4003C PCBs offer numerous advantages, making them an excellent choice for high-performance applications:
1)Ideal for Multi-Layer Board (MLB) Constructions:
The exceptional dimensional stability and CTE characteristics of RO4003C laminates make them well-suited for multi-layer board constructions. These laminates ensure reliable interconnection between layers and minimize the risk of stress-induced failures.
2)Cost-Effective Alternative to Microwave Laminates:
RO4003C laminates provide the same electrical performance as expensive microwave laminates but at a fraction of the cost. By utilizing the same processing methods as standard epoxy/glass laminates, RO4003C PCBs offer cost savings without compromising quality.
3)Designed for Performance-Sensitive, High-Volume Applications:
The superior electrical properties, thermal stability, and consistent manufacturing process of RO4003C PCBs make them an ideal choice for performance-sensitive applications. Industries such as telecommunications, automotive, and aerospace can benefit from the reliability and scalability of RO4003C PCBs.
4)Competitively Priced:
RO4003C PCBs offer a cost-effective solution for high-frequency applications without compromising on quality or performance. The competitive pricing makes them accessible to a wide range of industries and applications.
RO4003C PCB Stackup
2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers 4003C Core - 0.203 mm (8mil)
Copper_layer_2 - 35 μm
PCB Construction Details
The RO4003C high frequency circuit board follows a double layer circuit rigid construction, providing a robust and reliable foundation for high-frequency circuits.
Item |
Value |
Board Dimensions |
28.33mm x 167.16mm (+/- 0.15mm) |
Minimum Trace/Space |
5 mils / 5 mils |
Minimum Hole Size |
0.2mm |
Blind Vias |
No |
Finished Board Thickness |
0.3mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold |
Top Silkscreen |
Green |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Test |
100% prior to shipment |
PCB Statistics
The RO4003C PCB boasts the following statistics, highlighting its versatility and suitability for various applications:
PCB Statistics |
Value |
Components |
21 |
Total Pads |
63 |
Thru Hole Pads |
34 |
Top SMT Pads |
29 |
Bottom SMT Pads |
0 |
Vias |
79 |
Nets |
2 |
Artwork and Quality Standards
The RO4003C PCB substrate requires Gerber RS-274-X artwork files for manufacturing, ensuring accurate reproduction of the circuit design. It adheres to IPC-Class-2 quality standards, guaranteeing reliable performance and manufacturing consistency.
Worldwide Availability
The RO4003C PCB is available worldwide, making it easily accessible for customers across different regions and industries. Whether you are located in North America, Europe, Asia, or any other part of the world, you can benefit from the exceptional performance and reliability of RO4003C PCBs.
Typical Applications
The RO4003C PCB finds application in a wide range of industries and products where high-frequency performance and reliability are crucial. Some typical applications include:
1)Cellular Base Station Antennas and Power Amplifiers:
RO4003C PCBs provide the necessary performance and stability for wireless communication systems, ensuring reliable signal transmission and amplification.
2)RF Identification Tags:
The RO4003C PCB is well-suited for RF identification tags, enabling accurate and efficient communication in various tracking and identification systems.
3)Automotive Radar and Sensors:
With its high-frequency capabilities and thermal stability, the RO4003C PCB is an ideal choice for automotive radar systems and sensors, supporting critical safety and detection functionalities.
4)LNB's for Direct Broadcast Satellites:
The RO4003C PCB enables the development of high-performance low-noise block downconverters (LNBs) used in direct broadcast satellite systems, ensuring accurate reception and signal processing.
Conclusion
In conclusion, the RO4003C 8mil substrate PCB offers a high-performance and cost-effective solution for high-frequency applications. With its exceptional electrical properties, thermal stability, and reliable manufacturing process, the Rogers RO4003C PCB meets the demands of performance-sensitive industries worldwide. Whether it's for cellular base stations, RF identification systems, automotive radar, or satellite communication, the RO4003C PCB delivers reliable and efficient performance, ensuring the success of your advanced electronic designs.
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